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Issues
March 2023
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Special Section: InterPACK2021
GUEST EDITORIAL
Special Section on InterPACK2021
J. Electron. Packag. March 2023, 145(1): 010301.
doi: https://doi.org/10.1115/1.4056558
SPECIAL PAPERS
Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
J. Electron. Packag. March 2023, 145(1): 011101.
doi: https://doi.org/10.1115/1.4055464
Topics:
Aircraft
,
Cooling
,
Cooling systems
,
Flight
,
Heat exchangers
,
Stress
,
Temperature
,
Thermal management
,
Transients (Dynamics)
,
Motors
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
J. Electron. Packag. March 2023, 145(1): 011102.
doi: https://doi.org/10.1115/1.4055394
Topics:
Anodes
,
Creep
,
Current density
,
Electrodiffusion
,
Solder joints
,
Stress
,
Temperature
Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer
J. Electron. Packag. March 2023, 145(1): 011103.
doi: https://doi.org/10.1115/1.4055840
Topics:
High temperature
,
Inks
,
Reliability
,
Shear (Mechanics)
,
Sintering
,
Storage
,
Solders
,
Additive manufacturing
,
Solder joints
Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids
J. Electron. Packag. March 2023, 145(1): 011104.
doi: https://doi.org/10.1115/1.4055841
Topics:
Boiling
,
Critical heat flux
,
Heat flux
,
Heat transfer
,
Nanofluids
,
Water
,
Thermal resistance
,
Aluminum
,
Wall temperature
,
Temperature
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
J. Electron. Packag. March 2023, 145(1): 011105.
doi: https://doi.org/10.1115/1.4056031
Topics:
Coolants
,
Electrodes
,
Flow (Dynamics)
,
Fluids
,
Temperature
,
Cooling
Module-Level Thermal Interface Material Degradation in HALT
J. Electron. Packag. March 2023, 145(1): 011106.
doi: https://doi.org/10.1115/1.4056030
Topics:
Cycles
,
Life testing
,
Stress
,
Temperature
,
Testing
,
Thermal resistance
,
Vibration
,
Electronics
,
Reliability
,
Heating
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
J. Electron. Packag. March 2023, 145(1): 011107.
doi: https://doi.org/10.1115/1.4056445
Topics:
Design
,
Reliability
,
Simulation
,
Thermomechanics
,
Manufacturing
,
Solders
,
Computer simulation
,
Creep
,
Stress
,
Cycles
Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging
J. Electron. Packag. March 2023, 145(1): 011108.
doi: https://doi.org/10.1115/1.4056412
Topics:
Batteries
,
Cycles
,
Lithium-ion batteries
,
Machine learning
,
Regression models
,
Reliability
,
Stress
Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
J. Electron. Packag. March 2023, 145(1): 011109.
doi: https://doi.org/10.1115/1.4056477
Topics:
Adhesives
,
Electronics
,
Reliability
,
Surface preparation
,
Temperature
,
Stress
,
Inks
,
Silver
RESEARCH PAPERS
Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat
J. Electron. Packag. March 2023, 145(1): 011201.
doi: https://doi.org/10.1115/1.4054651
Topics:
Heat
,
Phase change materials
,
Steady state
,
Temperature
,
Transients (Dynamics)
,
Melting
,
Copper
,
Heat sinks
,
Tradeoffs
,
Simulation
Electrothermal Analysis of System in Package for Aerospace Application
J. Electron. Packag. March 2023, 145(1): 011202.
doi: https://doi.org/10.1115/1.4054462
Topics:
Aerospace industry
,
Design
,
Heat
,
Joules
,
Reliability
,
Simulation
,
System-in-package
,
Temperature
,
Vacuum
,
Errors
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs
J. Electron. Packag. March 2023, 145(1): 011203.
doi: https://doi.org/10.1115/1.4054698
Topics:
Diffusion (Physics)
,
Gallium nitride
,
Heat
,
Heating
,
Modeling
,
Phonons
,
Simulation
,
Temperature
,
Heat conduction
,
Junctions
Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
J. Electron. Packag. March 2023, 145(1): 011204.
doi: https://doi.org/10.1115/1.4054784
Topics:
Glass transition
,
Reliability
,
Semiconductor wafers
,
Storage
,
Stress
,
Temperature
,
Testing
,
Viscoelasticity
,
Solders
,
Failure
The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods
J. Electron. Packag. March 2023, 145(1): 011205.
doi: https://doi.org/10.1115/1.4054821
Topics:
Algebra
,
Deformation
,
Differential equations
,
Genetic algorithms
,
Stress
,
Errors
,
Solders
Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks
J. Electron. Packag. March 2023, 145(1): 011206.
doi: https://doi.org/10.1115/1.4054822
Topics:
Shock (Mechanics)
,
Contact resistance
,
Displacement
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