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Issues
March 2025
In Progress
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Review Articles
A Review of Mechanism and Technology of Hybrid Bonding
J. Electron. Packag. March 2025, 147(1): 010801.
doi: https://doi.org/10.1115/1.4065650
Topics:
Bonding
Research Papers
Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
J. Electron. Packag. March 2025, 147(1): 011001.
doi: https://doi.org/10.1115/1.4065077
Topics:
Ball-Grid-Array packaging
,
Computer simulation
,
Machine learning
,
Pressure
,
Solders
,
Valves
,
Epoxy adhesives
,
Epoxy resins
,
Simulation
,
Temperature
High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band
J. Electron. Packag. March 2025, 147(1): 011002.
doi: https://doi.org/10.1115/1.4065145
Topics:
Biomedicine
,
Energy gap
,
Radiation (Physics)
,
Design
,
Reflectance
,
Surface waves (Fluid)
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters
J. Electron. Packag. March 2025, 147(1): 011003.
doi: https://doi.org/10.1115/1.4065079
Topics:
Ball-Grid-Array packaging
,
Electronic packaging
,
Finite element model
,
Resonance
,
Vibration
,
Solders
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
J. Electron. Packag. March 2025, 147(1): 011004.
doi: https://doi.org/10.1115/1.4065667
Topics:
Bridges (Structures)
,
Glass
,
Integrated circuits
,
Optics
,
Switches
Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling
Rilwan Kayode Apalowo, Mohamad Aizat Abas, Muhamed Abdul Fatah Muhamed Mukhtar, Mohamad Riduwan Ramli
J. Electron. Packag. March 2025, 147(1): 011005.
doi: https://doi.org/10.1115/1.4065805
Topics:
Alloys
,
Fatigue life
,
Solder joints
,
Solders
,
Temperature profiles
,
Ball-Grid-Array packaging
,
Stress
,
Temperature
,
Cycles
,
Fatigue
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network
J. Electron. Packag. March 2025, 147(1): 011006.
doi: https://doi.org/10.1115/1.4065078
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
J. Electron. Packag. March 2025, 147(1): 011007.
doi: https://doi.org/10.1115/1.4066014
Topics:
Current density
,
Electrodiffusion
,
Failure
,
Solder joints
,
Solders
,
Stress
,
Temperature
,
Tension
,
Testing
,
Electrons
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
J. Electron. Packag. March 2025, 147(1): 011009.
doi: https://doi.org/10.1115/1.4066083
Topics:
Absorption
,
Epoxy resins
,
High temperature
,
Temperature
,
Thermal expansion
Application of the Nonlinear Fracture Mechanics Parameter T* to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
Nobuyuki Shishido, Yutaka Hayama, Yuki Akinaga, Shinya Taketomi, Masaaki Koganemaru, Seiya Hagihara, Noriyuki Miyazaki
J. Electron. Packag. March 2025, 147(1): 011010.
doi: https://doi.org/10.1115/1.4066100
Topics:
Creep
,
Cycles
,
Fatigue
,
Fracture (Materials)
,
Fracture mechanics
,
Temperature
,
Wire
,
Computational methods
,
Finite element analysis
Email alerts
RSS Feeds
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
J. Electron. Packag (March 2025)
