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Journal Articles

How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing?

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1995, 117(1): 88–92.
https://doi.org/10.1115/1.2792073
Published Online: March 1, 1995
View Article titled, How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing?
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Topics: Adhesives, Bending (Stress), Diluents, Elastic constants, Epoxy adhesives, Manufacturing, Mechanical behavior, Rails, Silicones, Stiffness
Journal Articles

Modeling the Vibration Restraints of Wedge Lock Card Guides

D. B. Barker, Y. S. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 189–194.
https://doi.org/10.1115/1.2909316
Published Online: June 1, 1993
View Article titled, Modeling the Vibration Restraints of Wedge Lock Card Guides
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Topics: Locks (Waterways), Modeling, Vibration, Wedges, Boundary-value problems, Deflection, Elastic constants, Frequency response, Rotation, Springs
Journal Articles

Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters

R. G. Ross, Jr., L. C. Wen, G. R. Mon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 165–172.
https://doi.org/10.1115/1.2909313
Published Online: June 1, 1993
View Article titled, Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters
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Topics: Construction, Creep, Relaxation (Physics), Solder joints, Stress, Solders, Stiffness, Complex systems, Cycles, Damage
Journal Articles

Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits

J. C. W. van Vroonhoven
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 28–33.
https://doi.org/10.1115/1.2909298
Published Online: March 1, 1993
View Article titled, Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits
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Topics: Adhesion, Delamination, Integrated circuits, Stress singularity, Fracture (Materials), Failure, Fracture (Process), Silicon chips, Stress, Temperature
Journal Articles

An Improved Procedure for the Determination of the Elastic Constants of Component-Lead-Board Assemblies

T. S. Chang, Edward B. Magrab
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1991, 113(4): 427–430.
https://doi.org/10.1115/1.2905432
Published Online: December 1, 1991
View Article titled, An Improved Procedure for the Determination of the Elastic Constants of Component-Lead-Board Assemblies
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Topics: Elastic constants, Torsion, Computer simulation