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Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021109.
Paper No: EP-21-1016
https://doi.org/10.1115/1.4052536
Published Online: October 14, 2021
View Article titled, Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling
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Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables
Journal Articles

Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications

Ange-Christian Iradukunda, Josh Kasitz, Hayden Carlton, David Huitink, Amol Deshpande, Fang Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031109.
Paper No: EP-20-1009
https://doi.org/10.1115/1.4046935
Published Online: May 4, 2020
View Article titled, Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
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Topics: Electrical properties, Electronics, Iron, Nanocomposites, Nanoparticles, Phase change materials, Temperature, Thermal conductivity, Thermal properties, Heat
Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041007.
Paper No: EP-18-1041
https://doi.org/10.1115/1.4041014
Published Online: September 10, 2018
View Article titled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress
Journal Articles

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031001.
Paper No: EP-11-1060
https://doi.org/10.1115/1.4029931
Published Online: September 1, 2015
View Article titled, Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections
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Topics: Annealing, Copper, Grain boundaries, Thin films, Electrical properties, Electron backscatter diffraction
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Electrical Properties of Polymers

Anthony J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2007, 129(1): 111.
https://doi.org/10.1115/1.2429720
Published Online: March 1, 2007
View Article titled, Electrical Properties of Polymers
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Topics: Electrical properties, Polymers
Journal Articles

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders S. G. Andræ, Gang Zou, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
https://doi.org/10.1115/1.1648057
Published Online: July 8, 2004
View Article titled, Characterization of Substrate Materials for System-in-a-Package Applications
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Topics: Ceramics, Cooling, Density, Epoxy resins, Finite element methods, Manufacturing, Microwaves, Reliability, System-in-package, Thermal expansion
Journal Articles

Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface

Tan Chee Wei, Abdul Razak Daud
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 617–620.
https://doi.org/10.1115/1.1604809
Published Online: December 15, 2003
View Article titled, Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface
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Topics: Intermetallic compounds, Bonding, Copper, Shear (Mechanics), Electrical properties, Electrical resistance, Wire bonding, Wire
Journal Articles

Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design

R. K. Agarwal, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 219–224.
https://doi.org/10.1115/1.2909321
Published Online: June 1, 1993
View Article titled, Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design
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Topics: Composite materials, Design, Electrical properties, Printed circuit boards, Textiles, Boundary-value problems, Epoxy adhesives, Epoxy resins, Finite element methods, Glass