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Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Article titled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

The Research For Quickly Measuring The Diameter And Roundness Of Solder Balls Based On Machine Vision Technology

Accepted Manuscript
Tongju Wang, Yahao Liu, Wenqian Zhang, Yongping Lei, Jian Lin, Hanguang Fu, Zipeng Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-23-1059
https://doi.org/10.1115/1.4063918
Published Online: October 30, 2023
View Article titled, The Research For Quickly Measuring The Diameter And Roundness Of Solder Balls Based On Machine Vision Technology
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Topics: Machinery, Solders, Computer software, Electronic packaging, Separation (Technology), Shapes, Software design, Soldering
Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021003.
Paper No: EP-22-1036
https://doi.org/10.1115/1.4055125
Published Online: August 18, 2022
View Article titled, An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging
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Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction
Journal Articles

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Shiva Farzinazar, Zongqing Ren, Jungyun Lim, Jae Choon Kim, Jaeho Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021118.
Paper No: EP-21-1038
https://doi.org/10.1115/1.4053948
Published Online: March 28, 2022
View Article titled, Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging
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Topics: Heat, Optimization, Thermomechanics, Topology, Design, Electronic packaging, Heat sinks
Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
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Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging

Ronald J. Warzoha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2021, 143(2): 020301.
Paper No: EP-21-1004
https://doi.org/10.1115/1.4050407
Published Online: March 19, 2021
View Article titled, Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging
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Topics: Electronic packaging, Microscale devices, Nanoscale phenomena, Storage
Journal Articles

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Ardalan Nasiri, Simon Ang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020902.
Paper No: EP-20-1060
https://doi.org/10.1115/1.4049292
Published Online: February 22, 2021
View Article titled, Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
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Topics: Bonding, Ceramics, Electronic packaging, Hardening (Curing), High temperature, Shear strength, Temperature, Fracture (Materials), Fourier transform infrared spectroscopy, Aluminum
Journal Articles

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2020, 142(3): 030301.
Paper No: EP-20-1092
https://doi.org/10.1115/1.4048039
Published Online: August 14, 2020
View Article titled, Special Issue on InterPACK 2019 – Part 1
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Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers
Journal Articles

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
https://doi.org/10.1115/1.4047414
Published Online: June 29, 2020
View Article titled, Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
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Topics: Heat, Metamaterials, Thermal management, Cooling, Temperature, Thermal conductivity, Electronic packaging, Design, Packaging, Anisotropy
Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011011.
Paper No: EP-19-1064
https://doi.org/10.1115/1.4045157
Published Online: November 8, 2019
View Article titled, Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers
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Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability
Journal Articles

Special Issue on InterPACK 2018

Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2019, 141(3): 030301.
Paper No: EP-19-1036
https://doi.org/10.1115/1.4043484
Published Online: May 8, 2019
View Article titled, Special Issue on InterPACK 2018
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Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers
Journal Articles

Special Section of Review Articles From Intel Corporation

Jin Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2019, 141(1): 010301.
Paper No: EP-18-1120
https://doi.org/10.1115/1.4042803
Published Online: March 6, 2019
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Topics: Data centers, Electronic packaging, Cooling, Design, Engineering teachers, Microelectronic packaging, Packaging, Semiconductor industry
Journal Articles

Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

Hamoon Azizsoltani, Achintya Haldar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041003.
Paper No: EP-17-1047
https://doi.org/10.1115/1.4040924
Published Online: August 20, 2018
View Article titled, Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept
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Topics: Failure, Finite element analysis, Modeling, Reliability, Solders, Thermomechanics, Lead-free solders, Electronic packaging, Uncertainty, Stress
Journal Articles

Special Section on InterPACK 2017—Part 2

Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
https://doi.org/10.1115/1.4039963
Published Online: May 9, 2018
View Article titled, Special Section on InterPACK 2017—Part 2
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Topics: Batteries, Density, Electronic packaging, Microelectromechanical systems, Optoelectronic devices, Packaging, Semiconductor wafers, Sensors, Reliability
Journal Articles

Special Section on InterPACK 2017—Part 1

Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2018, 140(1): 010301.
Paper No: EP-18-1005
https://doi.org/10.1115/1.4039090
Published Online: March 2, 2018
View Article titled, Special Section on InterPACK 2017—Part 1
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Topics: Electronic packaging, Reliability
Journal Articles

Special Section on IMECE 2016

Justin A. Weibel, S. Ravi Annapragada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2017, 139(2): 020301.
Paper No: EP-17-1032
https://doi.org/10.1115/1.4036627
Published Online: June 12, 2017
View Article titled, Special Section on IMECE 2016
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Topics: Failure analysis, Flexible electronics, Packaging, Reliability, Semiconductor wafers, Solders, Thermal analysis, Electronic packaging
Journal Articles

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian, Kyle Yazzie, Tsgereda Alazar, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020912.
Paper No: EP-17-1010
https://doi.org/10.1115/1.4036661
Published Online: June 12, 2017
View Article titled, Characterization of Bulk and Thin Film Fracture in Electronic Packaging
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Topics: Failure, Fracture (Materials), Fracture toughness, Solder masks, Stress, Thin films, Membranes, Fracture (Process), Electronic packaging, Testing
Journal Articles

Reviewers Acknowledgment for the Journal of Electronic Packaging

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. September 2016, 138(3): 038001.
Paper No: EP-16-1065
https://doi.org/10.1115/1.4033688
Published Online: June 6, 2016
View Article titled, Reviewers Acknowledgment for the Journal of Electronic Packaging
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Topics: Density, Electronic packaging, Failure analysis, Packaging
Journal Articles

Special Section on InterPACK 2015

Satish Chaparala, Ashish Gupta, Mehdi Asheghi, Jeffrey Suhling, Toru Ikeda, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. March 2016, 138(1): 010201.
Paper No: EP-16-1019
https://doi.org/10.1115/1.4032748
Published Online: March 10, 2016
View Article titled, Special Section on InterPACK 2015
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Topics: Packaging, Thermal analysis, Electronic packaging, Electronics, Microchannels, Fluids, Printed circuit boards