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Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
https://doi.org/10.1115/1.4047847
Published Online: August 17, 2020
View Article titled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices in another window
Topics: Coatings, Lasers, Manufacturing, Microcoolers, Micromachining, Silicon, Protective coatings, Bonding, Coating processes, Etching
Journal Articles

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040801.
Paper No: EP-18-1088
https://doi.org/10.1115/1.4043341
Published Online: May 17, 2019
View Article titled, Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging
Open the PDF for Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging in another window
Topics: Packaging, Semiconductor wafers, Solders, Warping, Etching
Journal Articles

Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network Modules

Bivragh Majeed, Kieran Delaney, John Barton, Niall McCarthy, Sean C. O’Mathuna, John Alderman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 236–245.
https://doi.org/10.1115/1.2229221
Published Online: November 24, 2005
View Article titled, Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network Modules
Open the PDF for Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network Modules in another window
Topics: Circuits, Copper, Manufacturing, Packaging, Polymers, Semiconductor wafers, Stiffness, Stress, Wireless sensor networks, Lasers
Journal Articles

Cleaning and Reflow of Pb-Sn C4 Solder Bumps

Caroline S. Lee, Doug C. Crafts, T. W. Eagar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 281–287.
https://doi.org/10.1115/1.2792106
Published Online: December 1, 1995
View Article titled, Cleaning and Reflow of Pb-Sn C4 Solder Bumps
Open the PDF for Cleaning and Reflow of Pb-Sn C4 Solder Bumps in another window
Topics: Solders, Tin, Etching, Corrosion, Diffusion (Physics), Electroplating, Metallurgy, Reflow soldering, Sulfur, Water
Journal Articles

An Integral Heat Sink for Cooling Microelectronic Components

S. H. Bhavnani, C.-P. Tsai, R. C. Jaeger, D. L. Eison
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 284–291.
https://doi.org/10.1115/1.2909330
Published Online: September 1, 1993
View Article titled, An Integral Heat Sink for Cooling Microelectronic Components
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Topics: Cooling, Heat sinks, Boiling, Heat, Silicon, Cavities, Atmospheric pressure, Etching, Flux (Metallurgy), Heat transfer