1-11 of 11
Evaporation
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041106.
Paper No: EP-21-1120
https://doi.org/10.1115/1.4052465
Published Online: October 13, 2021
View Article titled, Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer
Open the PDF for Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer in another window
Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors
Journal Articles

Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031105.
Paper No: EP-19-1137
https://doi.org/10.1115/1.4046767
Published Online: April 17, 2020
View Article titled, Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence
Open the PDF for Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence in another window
Topics: Evaporation, Fluorescence, Temperature, Vapors, Microscale devices
Includes: Supplementary data
Journal Articles

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Li Shan, Shuai Shuai, Binjian Ma, Zichen Du, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041008.
Paper No: EP-19-1038
https://doi.org/10.1115/1.4044962
Published Online: October 18, 2019
View Article titled, Numerical Investigation of Shape Effect on Microdroplet Evaporation
Open the PDF for Numerical Investigation of Shape Effect on Microdroplet Evaporation in another window
Topics: Diffusion (Physics), Drops, Evaporation, Vapors, Shapes, Simulation
Journal Articles

A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light

Ashreet Mishra, Agwu A. G. Nnanna
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031015.
Paper No: EP-18-1090
https://doi.org/10.1115/1.4044716
Published Online: September 24, 2019
View Article titled, A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light
Open the PDF for A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light in another window
Topics: Activated carbon, Evaporation, Nanofluids, Nanoparticles, Steam, Sunlight, Water, Solar energy
Journal Articles

Evaporative Wicking Phenomena on Nanotextured Surfaces

Duong Vy Le, Quang N. Pham, Jonggyu Lee, Shiwei Zhang, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031013.
Paper No: EP-18-1104
https://doi.org/10.1115/1.4044373
Published Online: September 19, 2019
View Article titled, Evaporative Wicking Phenomena on Nanotextured Surfaces
Open the PDF for Evaporative Wicking Phenomena on Nanotextured Surfaces in another window
Topics: Copper, Evaporation, Flux (Metallurgy), Heat, Heat flux, Permeability
Journal Articles

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Mahmood R. S. Shirazy, Luc G. Fréchette
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041003.
Paper No: EP-13-1098
https://doi.org/10.1115/1.4026353
Published Online: September 19, 2014
View Article titled, Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams
Open the PDF for Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams in another window
Topics: Containers, Copper, Evaporation, Flux (Metallurgy), Foams (Chemistry), Heat, Heat losses, Porosity, Temperature, Ethanol
Journal Articles

Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041011.
Paper No: EP-13-1125
https://doi.org/10.1115/1.4026878
Published Online: September 19, 2014
View Article titled, Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density
Open the PDF for Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density in another window
Topics: Carbon nanotubes, Current density, Damage, Multi-walled carbon nanotubes, Oxidation, Density, Electrodes, Atoms, Carbon, Evaporation
Journal Articles

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041012.
Paper No: EP-13-1130
https://doi.org/10.1115/1.4028332
Published Online: September 19, 2014
View Article titled, Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
Open the PDF for Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging in another window
Topics: Cavities, Columns (Structural), Copper, Evaporation, Fillers (Materials), Nanoparticles, Particulate matter, Self-assembly, Silver, Temperature
Journal Articles

An Experimental Investigation of a High Flux Heat Pipe Heat Sink

H. B. Ma, K. P. Lofgreen, G. P. Peterson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 18–22.
https://doi.org/10.1115/1.2159004
Published Online: May 10, 2005
View Article titled, An Experimental Investigation of a High Flux Heat Pipe Heat Sink
Open the PDF for An Experimental Investigation of a High Flux Heat Pipe Heat Sink in another window
Topics: Air flow, Condensers (steam plant), Design, Heat, Heat pipes, Heat sinks, Heat transfer, Temperature, Particulate matter, Evaporation
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
View Article titled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
Open the PDF for Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors in another window
Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes
Journal Articles

Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints

M. B. Bowers, I. Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 298–305.
https://doi.org/10.1115/1.2905701
Published Online: December 1, 1994
View Article titled, Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints
Open the PDF for Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints in another window
Topics: Computer cooling, Flow (Dynamics), Heat sinks, Microchannels, Pressure drop, Geometry, Compressibility, Energy dissipation, Heat, Boiling