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Journal Articles

Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules

Zihan Wu, Junki Min, Vanessa Smet, Markondeya Raj Pulugurtha, Venky Sundaram, Rao R. Tummala
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041001.
Paper No: EP-16-1151
https://doi.org/10.1115/1.4037221
Published Online: July 27, 2017
View Article titled, Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules
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Topics: Glass, Manufacturing, Filters
Journal Articles

Modular Microfluidic Filters Based on Transparent Membranes

E. Archibong, H. Tuazon, H. Wang, J. Winskas, A. L. Pyayt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041002.
Paper No: EP-16-1049
https://doi.org/10.1115/1.4034369
Published Online: August 19, 2016
View Article titled, Modular Microfluidic Filters Based on Transparent Membranes
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Topics: Filters, Filtration, Membranes, Microfluidics, Particulate matter, Transparency, Manufacturing, Microparticles
Journal Articles

Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter

Pradeep Lall, Hao Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021002.
Paper No: EP-14-1002
https://doi.org/10.1115/1.4028957
Published Online: June 1, 2015
View Article titled, Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter
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Topics: Filters, Light-emitting diodes, Particulate matter, Damage, Failure, Temperature, Physics
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration

Pradeep Lall, Ryan Lowe
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041013.
Paper No: EP-14-1004
https://doi.org/10.1115/1.4028163
Published Online: September 19, 2014
View Article titled, Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration
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Topics: Algorithms, Filters, Kalman filters, Particulate matter
Journal Articles

High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices

Maxat N. Touzelbaev, Josef Miler, Yizhang Yang, Gamal Refai-Ahmed, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031001.
Paper No: EP-12-1066
https://doi.org/10.1115/1.4024747
Published Online: July 24, 2013
View Article titled, High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices
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Topics: Filters, Modeling, Temperature, Thermal management, Transfer functions, Transients (Dynamics), Geometry, Filtration
Journal Articles

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

T.-Y. Tom Lee, R. Sharma, A. Peyre-Lavigne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 135–140.
https://doi.org/10.1115/1.2792599
Published Online: June 1, 1998
View Article titled, Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool
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Topics: Carbon, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption