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Journal Articles

Mandrel Bend Test of Screen-Printed Silver Conductors

Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031004.
Paper No: EP-22-1072
https://doi.org/10.1115/1.4056530
Published Online: January 11, 2023
View Article titled, Mandrel Bend Test of Screen-Printed Silver Conductors
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Topics: Cycles, Flexible electronics, Silver, Reliability, Inks, Damage, Imaging
Journal Articles

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031121.
Paper No: EP-20-1008
https://doi.org/10.1115/1.4047844
Published Online: August 7, 2020
View Article titled, Flexure and Twist Test Reliability Assurance of Flexible Electronics
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Topics: Bending (Stress), Cycles, Failure, Reliability, Sintering, Temperature, Inks, Flexible electronics, Testing, Printing
Journal Articles

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041113.
Paper No: EP-20-1037
https://doi.org/10.1115/1.4047579
Published Online: July 10, 2020
View Article titled, Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements
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Topics: Cycles, Failure, Flexible electronics, Modeling, Reliability, Electronics, Regression models, Failure analysis
Journal Articles

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031107.
Paper No: EP-19-1129
https://doi.org/10.1115/1.4046849
Published Online: April 24, 2020
View Article titled, Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink
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Topics: Circuits, Damage, Electrodiffusion, Failure analysis, Flexible electronics, Inks, Metals, Nanoparticles, Reliability, Density
Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041007.
Paper No: EP-18-1041
https://doi.org/10.1115/1.4041014
Published Online: September 10, 2018
View Article titled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress
Journal Articles

Special Section on IMECE 2016

Justin A. Weibel, S. Ravi Annapragada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2017, 139(2): 020301.
Paper No: EP-17-1032
https://doi.org/10.1115/1.4036627
Published Online: June 12, 2017
View Article titled, Special Section on IMECE 2016
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Topics: Failure analysis, Flexible electronics, Packaging, Reliability, Semiconductor wafers, Solders, Thermal analysis, Electronic packaging
Journal Articles

Stress Relief in Solder Joints Due to the Application of a Flex Circuit

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 240–243.
https://doi.org/10.1115/1.2905401
Published Online: September 1, 1991
View Article titled, Stress Relief in Solder Joints Due to the Application of a Flex Circuit
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Topics: Flexible electronics, Solder joints, Stress, Buckling, Design, Fatigue life, Stress analysis (Engineering), Thermal expansion