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Journal Articles

Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

Joshua Gess, Sushil Bhavnani, R. Wayne Johnson

Publisher: ASME

J. Electron. Packag. December 2016, 138(4): 041007.

Paper No: EP-16-1051

https://doi.org/10.1115/1.4034854

Published Online: October 20, 2016

View Article titled, Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

Topics: Coolants, Electronics, Flow (Dynamics), Fluids, Particulate matter, Design, Boiling, Fluid dynamics, Cooling

Journal Articles

Numerical Analysis of Blockage and Optimization of Heat Transfer Performance of Fractal-like Microchannel Nets

Xiang-Qi Wang, Arun S. Mujumdar, Christopher Yap

Publisher: ASME

J. Electron. Packag. March 2006, 128(1): 38–45.

https://doi.org/10.1115/1.2159007

Published Online: May 25, 2005

View Article titled, Numerical Analysis of Blockage and Optimization of Heat Transfer Performance of Fractal-like Microchannel Nets

Topics: Flow (Dynamics), Fractals, Heat transfer, Microchannels, Heat sinks, Temperature, Disks, Optimization, Fluid dynamics, Temperature distribution

Journal Articles

Three-Dimensional Paddle Shift Modeling for IC Packaging

Chien-Chang Pei, Sheng-Jye Hwang

Publisher: ASME

J. Electron. Packag. September 2005, 127(3): 324–334.

https://doi.org/10.1115/1.1938986

Published Online: December 2, 2004

View Article titled, Three-Dimensional Paddle Shift Modeling for IC Packaging

Topics: Computation, Deflection, Flow (Dynamics), Fluid dynamics, Geometry, Integrated circuit packaging, Integrated circuits, Mesh generation, Modeling, Molding

Journal Articles

Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks

Duckjong Kim, Sung Jin Kim, Alfonso Ortega

Publisher: ASME

J. Electron. Packag. September 2004, 126(3): 342–350.

https://doi.org/10.1115/1.1772415

Published Online: October 6, 2004

View Article titled, Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks

Topics: Heat sinks, Modeling, Heat transfer, Pressure drop, Fluid dynamics

Journal Articles

Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks

Duckjong Kim, Sung Jin Kim

Publisher: ASME

J. Electron. Packag. June 2004, 126(2): 247–255.

https://doi.org/10.1115/1.1756149

Published Online: July 8, 2004

View Article titled, Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks

Topics: Flow (Dynamics), Fluid dynamics, Heat sinks, Heat transfer, Modeling, Porous materials, Temperature distribution, Permeability, Pressure drop

Journal Articles

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Masoud Darbandi, Assistant Professor,, Gerry E. Schneider, Professor,

Publisher: ASME

J. Electron. Packag. June 2003, 125(2): 244–250.

https://doi.org/10.1115/1.1569508

Published Online: June 10, 2003

View Article titled, Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Topics: Approximation, Buoyancy, Cavities, Electronic packaging, Flow (Dynamics), Fluid dynamics, Heat transfer, Modeling, Natural convection, Rayleigh number

Journal Articles

Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions

H. Chai, Y. Zohar

Publisher: ASME

J. Electron. Packag. September 1999, 121(3): 137–142.

https://doi.org/10.1115/1.2792675

Published Online: September 1, 1999

View Article titled, Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions

Topics: Steady state, Transfer molding, Wire, Cavities, Density, Failure, Fluid dynamics, Transparency, Vehicles, Vents

Journal Articles

Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks

Y. Asako, Y. Yamaguchi, M. Faghri

Publisher: ASME

J. Electron. Packag. September 1999, 121(3): 202–208.

https://doi.org/10.1115/1.2792685

Published Online: September 1, 1999

View Article titled, Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks

Topics: Flow (Dynamics), Heat transfer, Ducts, Reynolds number, Computation, Flow visualization, Fluid dynamics, Numerical analysis, Plates (structures), Prandtl number

Journal Articles

Forced Convection Heat Transfer Augmentation in a Channel With A Localized Heat Source Using Fibrous Materials

D. Angirasa, G. P. Peterson

Publisher: ASME

J. Electron. Packag. March 1999, 121(1): 1–7.

https://doi.org/10.1115/1.2792656

Published Online: March 1, 1999

View Article titled, Forced Convection Heat Transfer Augmentation in a Channel With A Localized Heat Source Using Fibrous Materials

Topics: Forced convection, Heat, Reynolds number, Computer simulation, Convection, Electronic components, Flow (Dynamics), Fluid dynamics, Heat transfer, Porosity

Journal Articles

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

T.-Y. Tom Lee, R. Sharma, A. Peyre-Lavigne

Publisher: ASME

J. Electron. Packag. June 1998, 120(2): 135–140.

https://doi.org/10.1115/1.2792599

Published Online: June 1, 1998

View Article titled, Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Topics: Carbon, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption

Journal Articles

Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity

D. Mukutmoni, Y. K. Joshi, M. D. Kelleher

Publisher: ASME

J. Electron. Packag. December 1995, 117(4): 294–300.

https://doi.org/10.1115/1.2792108

Published Online: December 1, 1995

View Article titled, Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity

Topics: Computation, Thermal conductivity, Heat, Coolants, Cooling, Electrical measurement, Electronic components, Fluid dynamics, Fluids, Heat sinks

Journal Articles

Forced Convective Cooling Enhancement Through a Double Layer Design

B. T. F. Chung, H. H. Li

Publisher: ASME

J. Electron. Packag. March 1995, 117(1): 69–74.

https://doi.org/10.1115/1.2792069

Published Online: March 1, 1995

View Article titled, Forced Convective Cooling Enhancement Through a Double Layer Design

Topics: Cooling, Design, Flow (Dynamics), Computer simulation, Fluid dynamics, Heat, Heat transfer, Pressure, Printed circuit boards, Temperature

Journal Articles

Fluid Flow Modeling and Simulation for the Coaxial Cable of the LEASAT Antenna System

Hsien-Yang Yeh, Hen-Geul Yeh

Publisher: ASME

J. Electron. Packag. September 1992, 114(3): 358–360.

https://doi.org/10.1115/1.2905464

Published Online: September 1, 1992

View Article titled, Fluid Flow Modeling and Simulation for the Coaxial Cable of the LEASAT Antenna System

Topics: Cables, Fluid dynamics, Modeling, Simulation, Satellites, Pressure, Computer simulation, Fluid mechanics, Kinetic theory, Modeling analysis

Journal Articles

Thermal-Fluid Interactions of Neighboring Components on Air-Cooled Circuit Boards

V. P. Manno, K. Azar

Publisher: ASME

J. Electron. Packag. December 1991, 113(4): 374–381.

https://doi.org/10.1115/1.2905423

Published Online: December 1, 1991

View Article titled, Thermal-Fluid Interactions of Neighboring Components on Air-Cooled Circuit Boards

Topics: Printed circuit boards, Thermofluids, Fluid dynamics, Optimization, Experimental characterization, Flow (Dynamics), Heat transfer, Thermal characterization, Unsteady flow

Journal Articles

Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow

Ching Jen Chen, Ramiro H. Bravo

Publisher: ASME

J. Electron. Packag. September 1991, 113(3): 294–300.

https://doi.org/10.1115/1.2905409

Published Online: September 1, 1991

View Article titled, Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow

Topics: Channel flow, Heat transfer, Heat exchangers, Flow (Dynamics), Separation (Technology), Temperature, Computation, Fluid dynamics, Fluids, Numerical analysis

Journal citation

NARROW

Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

Numerical Analysis of Blockage and Optimization of Heat Transfer Performance of Fractal-like Microchannel Nets

Three-Dimensional Paddle Shift Modeling for IC Packaging

Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks

Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions

Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks

Forced Convection Heat Transfer Augmentation in a Channel With A Localized Heat Source Using Fibrous Materials

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity

Forced Convective Cooling Enhancement Through a Double Layer Design

Fluid Flow Modeling and Simulation for the Coaxial Cable of the LEASAT Antenna System

Thermal-Fluid Interactions of Neighboring Components on Air-Cooled Circuit Boards

Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow

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