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Journal Articles

Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals

Abhishek Deshpande, Aniket Bharamgonda, Qian Jiang, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041102.
Paper No: EP-23-1038
https://doi.org/10.1115/1.4063325
Published Online: October 5, 2023
View Article titled, Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals
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Topics: Anisotropy, Cooling, Crystals, Finite element analysis, Grain size, Shear (Mechanics), Solder joints, Solders, Stress, Tin
Journal Articles

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

Jinxin Liu, Zhiheng Huang, Paul P. Conway, Yang Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011009.
Paper No: EP-19-1058
https://doi.org/10.1115/1.4044648
Published Online: October 10, 2019
View Article titled, Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions
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Topics: Grain size, Shear (Mechanics), Simulation, Deformation, Reliability, Atoms, Simulation results, Copper
Journal Articles

Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging

Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
https://doi.org/10.1115/1.4003990
Published Online: June 23, 2011
View Article titled, Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
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Topics: Electronic packaging, Stainless steel, Surface finishing, Grain boundaries, Grain size, X-ray diffraction, X-ray analysis
Journal Articles

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

X. Zhao, M. Saka, M. Yamashita, F. Togoh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021003.
https://doi.org/10.1115/1.4001687
Published Online: June 11, 2010
View Article titled, Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films
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Topics: Current density, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion, Grain size, Temperature, Sputtering (Irradiation), Circuits, Damage, Strips
Journal Articles

A Damage-Mechanics-Based Constitutive Model for Solder Joints

C. Basaran, Y. Zhao, H. Tang, J. Gomez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 208–214.
https://doi.org/10.1115/1.1939822
Published Online: July 23, 2004
View Article titled, A Damage-Mechanics-Based Constitutive Model for Solder Joints
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Topics: Constitutive equations, Creep, Damage, Flow (Dynamics), Hardening, Kinematics, Solder joints, Solders, Stress, Temperature
Journal Articles

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

Pradeep Sharma, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 298–304.
https://doi.org/10.1115/1.1493203
Published Online: July 26, 2002
View Article titled, Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data
Open the PDF for Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data in another window
Topics: Creep, Cycles, Damage, Durability, Failure, Fatigue, Grain size, Hydrostatics, Micromechanics (Engineering), Solders
Journal Articles

A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

Sung Yi, Guangxing Luo, Kerm Sin Chian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 91–96.
https://doi.org/10.1115/1.1451845
Published Online: May 2, 2002
View Article titled, A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders
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Topics: Constitutive equations, Creep, Deformation, Dislocations, Grain boundaries, Grain size, Solders, Stress tensors, Temperature
Journal Articles

A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys

Z. Qian, W. Ren, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 162–168.
https://doi.org/10.1115/1.2792679
Published Online: September 1, 1999
View Article titled, A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys
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Topics: Alloys, Damage, Fatigue, Solders, Viscoplasticity, Constitutive equations, Creep, Damage mechanics, Deformation, Elasticity
Journal Articles

Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints

Z. Guo, Yi-Hsin Pao, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 100–104.
https://doi.org/10.1115/1.2792074
Published Online: June 1, 1995
View Article titled, Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints
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Topics: Deformation, Solder joints, Temperature, Shear rate, Shear stress, Creep, Diffusion (Physics), Dislocations, Grain size, High temperature
Journal Articles

A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints

N. Paydar, Y. Tong, H. U. Akay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 265–273.
https://doi.org/10.1115/1.2905697
Published Online: December 1, 1994
View Article titled, A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints
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Topics: Fatigue life, Finite element analysis, Solder joints, Cycles, Alloys, Constitutive equations, Creep, Design, Grain size, Manufacturing
Journal Articles

Time-Dependent Ductility of Electro-Deposited Copper

Yoshiki Oshida, P. C. Chen, J. D. Reid, T. Nishihara
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 448–454.
https://doi.org/10.1115/1.2905479
Published Online: December 1, 1992
View Article titled, Time-Dependent Ductility of Electro-Deposited Copper
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Topics: Copper, Ductility, Temperature, Annealing, Current density, Dislocation density, Electrodes, Electrons, Film thickness, Grain size
Journal Articles

Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates

Z. Mei, J. W. Morris, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 104–108.
https://doi.org/10.1115/1.2906404
Published Online: June 1, 1992
View Article titled, Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates
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Topics: Cooling, Fatigue, Solder joints, Furnaces, Grain size, Quenching (Metalworking), Shear (Mechanics), Solidification
Journal Articles

A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics

S. Russell, R. Caroselli, J. Mason, M. Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 122–127.
https://doi.org/10.1115/1.2906408
Published Online: June 1, 1992
View Article titled, A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics
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Topics: Fatigue, Nonlinear dynamics, Solders, Creep, Bifurcation, Chaos theory, Deformation, Engineering disciplines, Grain boundaries, Grain size
Journal Articles

A Creep/Relaxation Model Which Exhibits Chaotic Instability—Comparison With Solder Data

S. J. Russell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1991, 113(2): 190–193.
https://doi.org/10.1115/1.2905386
Published Online: June 1, 1991
View Article titled, A Creep/Relaxation Model Which Exhibits Chaotic Instability—Comparison With Solder Data
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Topics: Aeroelasticity, Solders, Stress, Chaos, Grain size, Steady state, Creep, Dynamics (Mechanics), Fatigue, Relaxation (Physics)
Journal Articles

The Creep-Fatigue Interaction in Solders and Solder Joints

D. S. Stone
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 100–103.
https://doi.org/10.1115/1.2904348
Published Online: June 1, 1990
View Article titled, The Creep-Fatigue Interaction in Solders and Solder Joints
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Topics: Creep, Fatigue, Solder joints, Solders, Fatigue cracks, Failure, Fatigue life, Grain boundaries, Cycles, Grain size