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Journal Articles

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Ardalan Nasiri, Simon Ang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020902.
Paper No: EP-20-1060
https://doi.org/10.1115/1.4049292
Published Online: February 22, 2021
View Article titled, Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
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Topics: Bonding, Ceramics, Electronic packaging, Hardening (Curing), High temperature, Shear strength, Temperature, Fracture (Materials), Fourier transform infrared spectroscopy, Aluminum
Journal Articles

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Hao Cheng, Yang Peng, Yun Mou, Qinglei Sun, Mingxiang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041003.
Paper No: EP-18-1070
https://doi.org/10.1115/1.4043645
Published Online: May 24, 2019
View Article titled, Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
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Topics: Cements (Adhesives), Ceramics, Dams, Manufacturing, Reliability, Shear strength, Low temperature, Molding, Temperature, Viscosity
Journal Articles

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

David A. Roberson, Ryan B. Wicker, Eric MacDonald
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031004.
Paper No: EP-13-1041
https://doi.org/10.1115/1.4030286
Published Online: September 1, 2015
View Article titled, Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics
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Topics: Electronics, Hardening (Curing), Inks, Temperature, Additive manufacturing, Silver, Manufacturing, Damage
Journal Articles

Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications

Erdal Uzunlar, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041001.
Paper No: EP-14-1114
https://doi.org/10.1115/1.4030952
Published Online: July 23, 2015
View Article titled, Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications
Open the PDF for Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications in another window
Topics: MEMS packaging, Microelectromechanical systems, Polymers, Temperature, Semiconductor wafers, Reactive-ion etching, Nuclear magnetic resonance, Hardening (Curing)
Journal Articles

Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection

Yasutada Nakagawa, Ryohei Yokoyama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011005.
https://doi.org/10.1115/1.4005954
Published Online: March 19, 2012
View Article titled, Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection
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Topics: Hardening (Curing), Heating, Optimization, Temperature, Viscosity, Anisotropy
Journal Articles

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

Shin-ichi Satake, Gaku Sorimachi, Takahiro Kanai, Jun Taniguchi, Noriyuki Unno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031003.
https://doi.org/10.1115/1.4001854
Published Online: September 9, 2010
View Article titled, Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV
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Topics: Hardening (Curing), Particulate matter, Resins, Ultraviolet radiation, Glass, Holography, Temperature, Displacement, Microchannels
Journal Articles

Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

Sangil Lee, M. J. Yim, Daniel Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
https://doi.org/10.1115/1.3153369
Published Online: July 31, 2009
View Article titled, Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill
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Topics: Flip-chip devices, Flow (Dynamics), Solders, Hardening (Curing), Chemical reactions, Wetting, Temperature, Flip-chip, Manufacturing
Journal Articles

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

Satoru Katsurayama, Hironori Tohmyoh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031005.
https://doi.org/10.1115/1.3144153
Published Online: June 23, 2009
View Article titled, Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability
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Topics: Flip-chip packages, Hardening (Curing), Manufacturing, Reliability, Temperature, Warping, Flow (Dynamics), Flip-chip devices
Journal Articles

Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions

K. K. Lee, S. C. Tan, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 52–58.
https://doi.org/10.1115/1.1846068
Published Online: March 21, 2005
View Article titled, Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions
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Topics: Adhesives, Bonding, Hardening (Curing), Shear (Mechanics), Ultraviolet radiation, Fourier transform infrared spectroscopy
Journal Articles

Three-Dimensional Paddle Shift Modeling for IC Packaging

Chien-Chang Pei, Sheng-Jye Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
https://doi.org/10.1115/1.1938986
Published Online: December 2, 2004
View Article titled, Three-Dimensional Paddle Shift Modeling for IC Packaging
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Topics: Computation, Deflection, Flow (Dynamics), Fluid dynamics, Geometry, Integrated circuit packaging, Integrated circuits, Mesh generation, Modeling, Molding
Journal Articles

Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications

Andrzej Mościcki, Jan Felba, Tadeusz Sobierajski, Józef Kudzia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 91–95.
https://doi.org/10.1115/1.1899165
Published Online: November 25, 2004
View Article titled, Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications
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Topics: Adhesives, Hardening (Curing), Fillers (Materials)
Journal Articles

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

C. W. Tang, Y. C. Chan, K. C. Hung, P. L. Tu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 397–402.
https://doi.org/10.1115/1.1510865
Published Online: December 12, 2002
View Article titled, Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies
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Topics: Flip-chip devices, Flow (Dynamics), Shear strength, Tin, Heating, Flip-chip assemblies, Hardening (Curing), Solders, Manufacturing, Strength (Materials)
Journal Articles

Optical Measurements of Shrinkage in UV-Cured Adhesives

A. J. Hudson, S. C. Martin, M. Hubert, J. K. Spelt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 352–354.
https://doi.org/10.1115/1.1498264
Published Online: December 12, 2002
View Article titled, Optical Measurements of Shrinkage in UV-Cured Adhesives
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Topics: Adhesives, Hardening (Curing), Shrinkage (Materials), Ultraviolet radiation, Ultraviolet cured adhesives, Optical measurement
Journal Articles

An Analytical Cure Model for Underfill Epoxies

R. L. Mahajan, Fellow ASME, C. P. Malhotra, R. K. Sharma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 391–396.
https://doi.org/10.1115/1.1510864
Published Online: December 12, 2002
View Article titled, An Analytical Cure Model for Underfill Epoxies
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Topics: Epoxy adhesives, Epoxy resins, Hardening (Curing), Heating, Heat transfer coefficients, Temperature
Journal Articles

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

L. J. Ernst, C. van ’t Hof, D. G. Yang, M. S. Kiasat, G. Q. Zhang, H. J. L. Bressers, J. F. J. Caers, A. W. J. den Boer, J. Janssen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 97–105.
https://doi.org/10.1115/1.1459471
Published Online: May 2, 2002
View Article titled, Mechanical Modeling and Characterization of the Curing Process of Underfill Materials
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Topics: Hardening (Curing), Relaxation (Physics), Shrinkage (Materials), Stress, Modeling, Flip-chip devices, Polymers, Storage, Deformation
Journal Articles

Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)

J. Zhang, C. Q. Cui, T. B. Lim, E. T. Kang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 291–296.
https://doi.org/10.1115/1.2793855
Published Online: December 1, 1999
View Article titled, Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
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Topics: Copper, Epoxy resins, Lamination, Printed circuit boards, Adhesion, Resins, Plasmas (Ionized gases), Atomic force microscopy, Polymerization, Temperature
Journal Articles

Alternative Curing Methods for FCOB Underfill

M. M. Merton, C. P. Malhotra, N. Nikmanesh, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 249–254.
https://doi.org/10.1115/1.2793848
Published Online: December 1, 1999
View Article titled, Alternative Curing Methods for FCOB Underfill
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Topics: Hardening (Curing), Condensation, Failure mechanisms, Heat transfer, Vapors, Delamination, Failure, Fatigue failure, Flip-chip, Heating
Journal Articles

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

Sejin Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 20–27.
https://doi.org/10.1115/1.483127
Published Online: August 17, 1999
View Article titled, Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation
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Topics: Cavities, Flow (Dynamics), Hardening (Curing), Molding, Packing (Shipments), Packings (Cushioning), Pressure, Semiconductors (Materials), Temperature, Viscosity
Journal Articles

Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages

S. Yi, K. Y. Sze
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1998, 120(4): 385–390.
https://doi.org/10.1115/1.2792651
Published Online: December 1, 1998
View Article titled, Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages
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Topics: Cooling, Finite element analysis, Hardening (Curing), Heat conduction, Manufacturing, Materials properties, Molded plastics, Molding, Residual stresses, Stress
Journal Articles

In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

A. S. Voloshin, P.-H. Tsao, R. A. Pearson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1998, 120(3): 314–318.
https://doi.org/10.1115/1.2792639
Published Online: September 1, 1998
View Article titled, In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive
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Topics: Adhesives, Residual stresses, Epoxy adhesives, Epoxy resins, Stress, Hardening (Curing), Absorption, Cooling, Interferometry, Relaxation (Physics)