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Journal Articles

A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers

Soumya Bandyopadhyay, Justin A. Weibel

J. Electron. Packag. June 2023, 145(2): 021009.

Paper No: EP-22-1047

DOI: https://doi.org/10.1115/1.4055987

Published Online: November 1, 2022

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Topics: Heat, Transients (Dynamics), Temperature, Anisotropy

Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. June 2023, 145(2): 021001.

Paper No: EP-22-1003

DOI: https://doi.org/10.1115/1.4054972

Published Online: August 8, 2022

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Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)

Journal Articles

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Han-Ling Li, Yang Shen, Yu-Chao Hua, S. L. Sobolev, Bing-Yang Cao

J. Electron. Packag. March 2023, 145(1): 011203.

Paper No: EP-22-1007

DOI: https://doi.org/10.1115/1.4054698

Published Online: July 13, 2022

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Topics: Diffusion (Physics), Gallium nitride, Heat, Heating, Modeling, Phonons, Simulation, Temperature, Heat conduction, Junctions

Journal Articles

Electrothermal Analysis of System in Package for Aerospace Application

Hao-hang Su, Shuai Fu, Su-yuan Li, Jiang Bian

J. Electron. Packag. March 2023, 145(1): 011202.

Paper No: EP-22-1014

DOI: https://doi.org/10.1115/1.4054462

Published Online: July 7, 2022

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Topics: Aerospace industry, Design, Heat, Joules, Reliability, Simulation, System-in-package, Temperature, Vacuum, Errors

Journal Articles

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Michael Deckard, Darin J. Sharar, Michael Fish, Patrick J. Shamberger

J. Electron. Packag. March 2023, 145(1): 011201.

Paper No: EP-21-1153

DOI: https://doi.org/10.1115/1.4054651

Published Online: July 7, 2022

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Topics: Heat, Phase change materials, Steady state, Temperature, Transients (Dynamics), Melting, Copper, Heat sinks, Tradeoffs, Simulation

Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. September 2022, 144(3): 031017.

Paper No: EP-21-1164

DOI: https://doi.org/10.1115/1.4054461

Published Online: May 19, 2022

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Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer

Journal Articles

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Tolga Emir, Hamza Ourabi, Mete Budakli, Mehmet Arik

J. Electron. Packag. December 2022, 144(4): 040801.

Paper No: EP-21-1129

DOI: https://doi.org/10.1115/1.4054184

Published Online: April 28, 2022

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Topics: Boiling, Bubbles, Critical heat flux, Heat transfer, Pool boiling, Pressure, Nucleation (Physics), Fluids, Water, Heat

Journal Articles

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Shiva Farzinazar, Zongqing Ren, Jungyun Lim, Jae Choon Kim, Jaeho Lee

J. Electron. Packag. June 2022, 144(2): 021118.

Paper No: EP-21-1038

DOI: https://doi.org/10.1115/1.4053948

Published Online: March 28, 2022

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Topics: Heat, Optimization, Thermomechanics, Topology, Design, Electronic packaging, Heat sinks

Journal Articles

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Junjie Dai, Yuexin Zhang, Zhankun Li, Mingming Chen, Yuhua Guo, Zhekun Fan, Junhui Li

J. Electron. Packag. September 2022, 144(3): 031014.

Paper No: EP-21-1121

DOI: https://doi.org/10.1115/1.4053889

Published Online: March 8, 2022

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Topics: Columns (Structural), Copper, Current density, Flip-chip devices, Solder joints, Solders, Temperature, Tin, Joules, Reliability

Journal Articles

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia

J. Electron. Packag. December 2022, 144(4): 041015.

Paper No: EP-21-1139

DOI: https://doi.org/10.1115/1.4053643

Published Online: February 23, 2022

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Topics: Air flow, Design, Stress, Flow (Dynamics), Control systems, Heat, Data centers, Inertia (Mechanics)

Journal Articles

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Wei Tong, Alireza Ganjali, Omidreza Ghaffari, Chady al Sayed, Luc Fréchette, Julien Sylvestre

J. Electron. Packag. December 2022, 144(4): 041011.

Paper No: EP-21-1119

DOI: https://doi.org/10.1115/1.4053310

Published Online: January 28, 2022

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Topics: Boiling, Cooling, Heat, Heat transfer coefficients, Temperature, Critical heat flux, Temperature distribution, Flat heat pipes

Journal Articles

Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model

Wing K. Yeung, Tung T. Lam

J. Electron. Packag. September 2022, 144(3): 031011.

Paper No: EP-21-1028

DOI: https://doi.org/10.1115/1.4052948

Published Online: December 27, 2021

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Topics: Heat flux, Relaxation (Physics), Temperature, Elemental semiconductors, Temperature gradient, Heat

Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. June 2022, 144(2): 021110.

Paper No: EP-21-1048

DOI: https://doi.org/10.1115/1.4052767

Published Online: November 22, 2021

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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities

Journal Articles

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

Filippo Cataldo, Yuri Carmelo Crea

J. Electron. Packag. December 2021, 143(4): 041110.

Paper No: EP-21-1094

DOI: https://doi.org/10.1115/1.4052670

Published Online: November 5, 2021

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Topics: Condensers (steam plant), Heat, Stress, Flow (Dynamics), Temperature, Fluids, Modeling

Journal Articles

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Justin Hollis, Darin J. Sharar, Todd Bandhauer

J. Electron. Packag. December 2021, 143(4): 041111.

Paper No: EP-21-1103

DOI: https://doi.org/10.1115/1.4052669

Published Online: November 5, 2021

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Topics: Copper, Cycles, Junctions, Phase change materials, Temperature, Heat, Composite materials, Transients (Dynamics), Thermal management, Cities

Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock

J. Electron. Packag. June 2022, 144(2): 021105.

Paper No: EP-21-1012

DOI: https://doi.org/10.1115/1.4052071

Published Online: September 24, 2021

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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat

Journal Articles

Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads

Caleb Anderson, Joshua Richey, Michael Fish, Todd Bandhauer

J. Electron. Packag. December 2021, 143(4): 041104.

Paper No: EP-21-1102

DOI: https://doi.org/10.1115/1.4052360

Published Online: September 24, 2021

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Topics: Boiling, Heat, Stress, Temperature, Transients (Dynamics), Steady state, Heat flux, Vapors

Journal Articles

High-Performance Planar Thermal Diode With Wickless Components

George Damoulakis, Mohamad Jafari Gukeh, Theodore P. Koukoravas, Constantine M. Megaridis

J. Electron. Packag. September 2022, 144(3): 031004.

Paper No: EP-21-1020

DOI: https://doi.org/10.1115/1.4051467

Published Online: September 15, 2021

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Topics: Heat, Vapors, Temperature, Thermal resistance, Heat transfer, Condensation, Copper

Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre

J. Electron. Packag. December 2021, 143(4): 041103.

Paper No: EP-21-1083

DOI: https://doi.org/10.1115/1.4051943

Published Online: August 27, 2021

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Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling

Journal Articles

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Qi Jin, John T. Wen, Shankar Narayanan

J. Electron. Packag. December 2021, 143(4): 041102.

Paper No: EP-21-1081

DOI: https://doi.org/10.1115/1.4051942

Published Online: August 20, 2021

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Topics: Compressors, Design, Flow (Dynamics), Heat, Oscillations, Pressure drop, Secondary cells, Stability, Stress, Valves

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Journal citation

NARROW

A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Electrothermal Analysis of System in Package for Aerospace Application

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads

High-Performance Planar Thermal Diode With Wickless Components

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

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