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Journal Articles

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Behnam Garakani, Udara S. Somarathna, Ashraf Umar, Gurvinder Singh Khinda, Mohamed Youssef M. Abdelatty, El Mehdi Abbara, Sari Al Zerey, Mike Hopkins, Sai Srinivas, Chuck Kinzel, Christopher Halseth, Mark Ronay, Mark D. Poliks
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031006.
Paper No: EP-22-1008
https://doi.org/10.1115/1.4056640
Published Online: February 1, 2023
View Article titled, Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics
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Topics: Fatigue, Liquid metals, Tension, Transmission lines, Cycles, Fatigue testing, Reliability, Wearable devices, Metals, Simulation
Journal Articles

Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid Metal

Yuntao Cui, Yujie Ding, Shuo Xu, Yushu Wang, Wei Rao, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011001.
Paper No: EP-18-1021
https://doi.org/10.1115/1.4041665
Published Online: February 25, 2019
View Article titled, Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid Metal
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Topics: Aluminum alloys, Corrosion resistance, Gallium, Heat transfer, Liquid metals, Thermal conductivity, Oxidation, Heat, Coatings, Cooling
Journal Articles

Flexible RFID Tag Inductor Printed by Liquid Metal Ink Printer and Its Characterization

Yunxia Gao, Rui Liu, Xianping Wang, Jing Liu, Qianfeng Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031007.
Paper No: EP-14-1120
https://doi.org/10.1115/1.4034062
Published Online: July 21, 2016
View Article titled, Flexible RFID Tag Inductor Printed by Liquid Metal Ink Printer and Its Characterization
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Topics: Inductors, Inks, Liquid metals, Printing, Shapes
Journal Articles

Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone Oil

Shengfu Mei, Yunxia Gao, Zhongshan Deng, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011009.
Paper No: EP-13-1088
https://doi.org/10.1115/1.4026414
Published Online: January 24, 2014
View Article titled, Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone Oil
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Topics: Drops, Liquid metals, Silicones, Thermal conductivity
Journal Articles

Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal

Peipei Li, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
https://doi.org/10.1115/1.4005297
Published Online: December 9, 2011
View Article titled, Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal
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Topics: Convection, Cooling, Heat, Liquid metals, Temperature, Thermal resistance, Water, Stress, Coolants, Computer cooling
Journal Articles

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

Yueguang Deng, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031009.
https://doi.org/10.1115/1.4002012
Published Online: September 9, 2010
View Article titled, Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs
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Topics: Cooling, Design, Energy dissipation, Heat, Liquid metals, Pumps, Thermal resistance, Water, Flow (Dynamics), Engineering prototypes
Journal Articles

Computer Simulation of Solder Bridging Phenomena

T. J. Singler, Xu Zhang, K. A. Brakke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 122–126.
https://doi.org/10.1115/1.2792141
Published Online: September 1, 1996
View Article titled, Computer Simulation of Solder Bridging Phenomena
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Topics: Computer simulation, Solders, Bridges (Structures), Liquid metals, Stability, Equilibrium (Physics)