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Journal Articles

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Hua Zhu, Wei Li, Junye Li, Kuang Sheng, Shuai Shao, Haiwang Li, Zhi Tao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031006.
Paper No: EP-18-1092
https://doi.org/10.1115/1.4043476
Published Online: May 17, 2019
View Article titled, Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Subcooling, Temperature, Heat flux, Bubbles, Nucleate boiling, Flux (Metallurgy)
Journal Articles

Steady-State Behavior of a Three-Dimensional Pool-Boiling System

Michel Speetjens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041102.
https://doi.org/10.1115/1.2993147
Published Online: November 13, 2008
View Article titled, Steady-State Behavior of a Three-Dimensional Pool-Boiling System
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Topics: Bifurcation, Boiling, Cooling, Fluids, Heat, Heat flux, Pool boiling, Steady state, Temperature, Heat transfer
Journal Articles

Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling

I. Mudawar, T. M. Anderson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 89–100.
https://doi.org/10.1115/1.2909306
Published Online: March 1, 1993
View Article titled, Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling
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Topics: Cooling, Optimization, Pool boiling, Boiling, Boundary-value problems, Flux (Metallurgy), Heat, Metal surfaces, Nucleate boiling, Subcooling
Journal Articles

Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling

C. O. Gersey, I. Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 78–88.
https://doi.org/10.1115/1.2909305
Published Online: March 1, 1993
View Article titled, Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling
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Topics: Boiling, Critical heat flux, Flow (Dynamics), Nucleate boiling, Subcooling, Heat transfer coefficients, Coolants, Forced convection, Multi-chip modules
Journal Articles

Design Parameters and Practical Considerations in the Two-Phase Forced-Convection Cooling of Multi-Chip Modules

Christopher O. Gersey, Thomas C. Willingham, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 280–289.
https://doi.org/10.1115/1.2905452
Published Online: September 1, 1992
View Article titled, Design Parameters and Practical Considerations in the Two-Phase Forced-Convection Cooling of Multi-Chip Modules
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Topics: Cooling, Design, Forced convection, Multi-chip modules, Critical heat flux, Heart failure, Flow (Dynamics), Subcooling, Boiling, Coolants
Journal Articles

Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: II—Forced Convection Boiling

T. J. Heindel, S. Ramadhyani, F. P. Incropera
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 63–70.
https://doi.org/10.1115/1.2905443
Published Online: March 1, 1992
View Article titled, Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: II—Forced Convection Boiling
Open the PDF for Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: II—Forced Convection Boiling in another window
Topics: Boiling, Cooling, Forced convection, Heat, Nucleate boiling, Fluids, Flow (Dynamics), Heat flux, Subcooling, Heat transfer