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Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021010.
Paper No: EP-22-1043
https://doi.org/10.1115/1.4056113
Published Online: November 11, 2022
View Article titled, Effective Constitutive Relations for Sintered Nano Copper Joints
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Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering
Journal Articles

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021113.
Paper No: EP-21-1059
https://doi.org/10.1115/1.4052715
Published Online: January 4, 2022
View Article titled, Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation
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Topics: Flip-chip, Glass transition, High temperature, Mechanical properties, Oxidation, Solders, Storage, Temperature, Viscoelasticity, Optical microscopes
Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011007.
Paper No: EP-20-1120
https://doi.org/10.1115/1.4050871
Published Online: August 6, 2021
View Article titled, Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds
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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength
Journal Articles

Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid Metal

Yuntao Cui, Yujie Ding, Shuo Xu, Yushu Wang, Wei Rao, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011001.
Paper No: EP-18-1021
https://doi.org/10.1115/1.4041665
Published Online: February 25, 2019
View Article titled, Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid Metal
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Topics: Aluminum alloys, Corrosion resistance, Gallium, Heat transfer, Liquid metals, Thermal conductivity, Oxidation, Heat, Coatings, Cooling
Journal Articles

Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials

Yunxia Gao, Xianping Wang, Jing Liu, Qianfeng Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011002.
Paper No: EP-16-1099
https://doi.org/10.1115/1.4035025
Published Online: November 23, 2016
View Article titled, Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials
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Topics: Alloys, Copper, Gallium, Gallium alloys, Temperature, Thermal conductivity, Oxidation, Thermal resistance, Aluminum alloys, Metals
Journal Articles

Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041011.
Paper No: EP-13-1125
https://doi.org/10.1115/1.4026878
Published Online: September 19, 2014
View Article titled, Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density
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Topics: Carbon nanotubes, Current density, Damage, Multi-walled carbon nanotubes, Oxidation, Density, Electrodes, Atoms, Carbon, Evaporation
Journal Articles

Effect of Indium Content on the Melting Point, Dross, and Oxidation Characteristics of Sn-2Ag-3Bi-xIn Solders

Ae-Jeong Jeon, Seong-Jun Kim, Sang-Hoon Lee, Chung-Yun Kang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021006.
Paper No: EP-12-1082
https://doi.org/10.1115/1.4023529
Published Online: March 28, 2013
View Article titled, Effect of Indium Content on the Melting Point, Dross, and Oxidation Characteristics of Sn-2Ag-3Bi-xIn Solders
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Topics: Alloys, Oxidation, Solders, Tin, Temperature, Melting
Journal Articles

Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites

Xiaobo Sun, Aiping Yu, Palanisamy Ramesh, Elena Bekyarova, Mikhail E. Itkis, Robert C. Haddon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020905.
https://doi.org/10.1115/1.4003988
Published Online: June 7, 2011
View Article titled, Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites
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Topics: Carbon nanotubes, Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Graphite, Oxidation, Particle size, Polymers, Thermal conductivity
Journal Articles

Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead Package

S. Abdullah, M. F. Abdullah, A. K. Ariffin, A. Jalar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031002.
https://doi.org/10.1115/1.3144155
Published Online: June 16, 2009
View Article titled, Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead Package
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Topics: Delamination, Fracture (Materials), Oxidation, Reliability, Shear (Mechanics), Statistical analysis, Copper, Stress
Journal Articles

Advances in Bonding Technology for Electronic Packaging

Chin C. Lee, Chen Y. Wang, Goran Matijasevic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 201–207.
https://doi.org/10.1115/1.2909318
Published Online: June 1, 1993
View Article titled, Advances in Bonding Technology for Electronic Packaging
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Topics: Bonding, Electronic packaging, Alloys, Temperature, Acoustics, Diffusion (Physics), Melting point, Microscopy, Oxidation, Soldering
Journal Articles

The Creep-Fatigue Interaction in Solders and Solder Joints

D. S. Stone
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 100–103.
https://doi.org/10.1115/1.2904348
Published Online: June 1, 1990
View Article titled, The Creep-Fatigue Interaction in Solders and Solder Joints
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Topics: Creep, Fatigue, Solder joints, Solders, Fatigue cracks, Failure, Fatigue life, Grain boundaries, Cycles, Grain size
Journal Articles

Oxidation of (Pb, Sn) and (Pb, In) Alloys

R. A. Konetzki, M. X. Zhang, D. A. Sluzewski, Y. A. Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 175–178.
https://doi.org/10.1115/1.2904359
Published Online: June 1, 1990
View Article titled, Oxidation of (Pb, Sn) and (Pb, In) Alloys
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Topics: Alloys, Oxidation, Tin, Augers, Grain boundaries, Diffusion (Physics), Electron spectroscopy, Eutectic alloys, Indium alloys, Temperature