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Journal Articles

Improved Method of C O 2 Laser Cutting of Aluminum Nitride

Raathai Molian, Pranav Shrotriya, Pal Molian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024501.
https://doi.org/10.1115/1.2912223
Published Online: May 8, 2008
View Article titled, Improved Method of C O 2 Laser Cutting of Aluminum Nitride
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Topics: Aluminum, Cutting, Fracture (Materials), Laser cutting, Lasers, Thermal stresses, Fracture (Process), Oxygen, Stress
Journal Articles

Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection

Y. S. Son, T. L. Bergman, M. T. Hyun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 317–322.
https://doi.org/10.1115/1.2792111
Published Online: December 1, 1995
View Article titled, Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection
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Topics: Heat transfer, Nitrogen, Ovens, Reflow soldering, Simulation, Buoyancy, Computer simulation, Cooling, Fluctuations (Physics), Heating
Journal Articles

Residual Stresses for In-Situ Deposition of Thin-Film High-Temperature Superconductors

P. E. Phelan, M. N. Ghasemi Nejhad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 249–257.
https://doi.org/10.1115/1.2905695
Published Online: December 1, 1994
View Article titled, Residual Stresses for In-Situ Deposition of Thin-Film High-Temperature Superconductors
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Topics: High temperature superconductors, Residual stresses, Thin films, Oxygen, Stress, Dimensions, Shrinkage (Materials), Stoichiometry, Temperature, Thermal expansion
Journal Articles

Solder Joint Reliability — Design Implications From Finite Element Modeling and Experimental Testing

H. K. Charles, Jr., G. V. Clatterbaugh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 135–146.
https://doi.org/10.1115/1.2904354
Published Online: June 1, 1990
View Article titled, Solder Joint Reliability — Design Implications From Finite Element Modeling and Experimental Testing
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Topics: Design, Finite element analysis, Modeling, Reliability, Solder joints, Testing, Fatigue life, Stress, Fracture toughness, Temperature