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Journal Articles

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Tolga Emir, Hamza Ourabi, Mete Budakli, Mehmet Arik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2022, 144(4): 040801.
Paper No: EP-21-1129
https://doi.org/10.1115/1.4054184
Published Online: April 28, 2022
View Article titled, Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review
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Topics: Boiling, Bubbles, Critical heat flux, Heat transfer, Pool boiling, Pressure, Nucleation (Physics), Fluids, Water, Heat
Journal Articles

Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces

Zhenyu She, Vijay K. Dhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041113.
Paper No: EP-21-1108
https://doi.org/10.1115/1.4052716
Published Online: November 9, 2021
View Article titled, Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces
Open the PDF for Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces in another window
Topics: Critical heat flux, Disks, Vapors, Vessels, Boiling, Wavelength, Pool boiling
Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041103.
Paper No: EP-21-1083
https://doi.org/10.1115/1.4051943
Published Online: August 27, 2021
View Article titled, Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Open the PDF for Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics in another window
Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling
Journal Articles

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Daeyoung Kong, Chi Zhang, Michael T. Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020906.
Paper No: EP-18-1003
https://doi.org/10.1115/1.4040088
Published Online: May 9, 2018
View Article titled, Enhanced Heat Transfer Using Microporous Copper Inverse Opals
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Topics: Copper, Critical heat flux, Heat transfer, Pool boiling, Boiling, Heat transfer coefficients, Bubbles
Journal Articles

Self-Propelled Sliding Bubble Motion Induced by Surface Microstructure in Pool Boiling of a Dielectric Fluid Under Microgravity

Naveenan Thiagarajan, Sushil H. Bhavnani, Vinod Narayanan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021009.
Paper No: EP-14-1073
https://doi.org/10.1115/1.4029246
Published Online: June 1, 2015
View Article titled, Self-Propelled Sliding Bubble Motion Induced by Surface Microstructure in Pool Boiling of a Dielectric Fluid Under Microgravity
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Topics: Bubbles, Vapors, Liquid films, Fluids, Pool boiling
Journal Articles

Steady-State Behavior of a Three-Dimensional Pool-Boiling System

Michel Speetjens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041102.
https://doi.org/10.1115/1.2993147
Published Online: November 13, 2008
View Article titled, Steady-State Behavior of a Three-Dimensional Pool-Boiling System
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Topics: Bifurcation, Boiling, Cooling, Fluids, Heat, Heat flux, Pool boiling, Steady state, Temperature, Heat transfer
Journal Articles

Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components

Hiroshi Honda, ZhengGuo Zhang, Nobuo Takata
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 317–324.
https://doi.org/10.1115/1.1772412
Published Online: October 6, 2004
View Article titled, Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components
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Topics: Boiling, Critical heat flux, Electronic components, Flow (Dynamics), Heat transfer, Pool boiling, Ducts, Condensers (steam plant), Heat flux, Cooling
Journal Articles

Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package

A. A. Watwe, A. Bar-Cohen, A. McNeil
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 95–105.
https://doi.org/10.1115/1.2792226
Published Online: June 1, 1997
View Article titled, Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package
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Topics: Pool boiling, Pressure, Subcooling, Critical heat flux, Boiling, Nucleate pool boiling
Journal Articles

Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

S. M. You, T. W. Simon, A. Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 17–25.
https://doi.org/10.1115/1.2792195
Published Online: March 1, 1997
View Article titled, Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface
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Topics: Heat transfer, Pool boiling, Boiling, Bubbles, Fluids, Heat, Heating, Aluminum, Computer cooling, Platinum
Journal Articles

Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling

I. Mudawar, T. M. Anderson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 89–100.
https://doi.org/10.1115/1.2909306
Published Online: March 1, 1993
View Article titled, Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling
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Topics: Cooling, Optimization, Pool boiling, Boiling, Boundary-value problems, Flux (Metallurgy), Heat, Metal surfaces, Nucleate boiling, Subcooling
Journal Articles

Subcooled Pool Boiling Critical Heat Flux in Dielectric Liquid Mixtures

T. Y. Tom Lee, Mali Mahalingam, Peter J. C. Normington
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1993, 115(1): 134–137.
https://doi.org/10.1115/1.2909294
Published Online: March 1, 1993
View Article titled, Subcooled Pool Boiling Critical Heat Flux in Dielectric Liquid Mixtures
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Topics: Critical heat flux, Dielectric liquids, Pool boiling, Subcooling, Boiling, Data collection, Phase transition temperature, Temperature
Journal Articles

Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips

I. Mudawar, T. M. Anderson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 375–382.
https://doi.org/10.1115/1.2904392
Published Online: December 1, 1990
View Article titled, Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips
Open the PDF for Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips in another window
Topics: Coolants, Cooling systems, Density, Design, Pool boiling, Pressure, Subcooling, Boiling, Critical heat flux, Temperature
Journal Articles

Enhanced Boiling on Microconfigured Surfaces

N. Wright, B. Gebhart
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 112–120.
https://doi.org/10.1115/1.3226515
Published Online: June 1, 1989
View Article titled, Enhanced Boiling on Microconfigured Surfaces
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Topics: Boiling, Electric potential, Heat transfer, Heating, Natural convection, Nucleate pool boiling, Pool boiling, Silicon, Subcooling, Water