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Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Article titled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 373–381.
https://doi.org/10.1115/1.2804085
Published Online: March 25, 2007
View Article titled, Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
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Topics: Ball-Grid-Array packaging, Displacement, Errors, Finite element model, Reliability, Shells, Shock (Mechanics), Transients (Dynamics), Dynamics (Mechanics), Modeling
Journal Articles

Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods

B. Han, Y. Guo, C. K. Lim, D. Caletka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 157–163.
https://doi.org/10.1115/1.2792146
Published Online: September 1, 1996
View Article titled, Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods
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Topics: Computer simulation, Design, Displacement measurement, Microelectronic packaging, Interferometry, Displacement, Cycles, Electronic packaging, Geometry, Modeling
Journal Articles

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

B. Han, Y. Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 185–191.
https://doi.org/10.1115/1.2792090
Published Online: September 1, 1995
View Article titled, Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry
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Topics: Electronic packaging, Interferometry, Thermal deformation, Deformation, Packaging, Design, Displacement measurement, Mechanical behavior, Optimization, Product development