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Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011005.
Paper No: EP-20-1097
https://doi.org/10.1115/1.4049813
Published Online: August 6, 2021
View Article titled, Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals
Open the PDF for Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals in another window
Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering
Journal Articles

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

Tae-Yong Park, Hyun-Ung Oh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011006.
Paper No: EP-20-1108
https://doi.org/10.1115/1.4050512
Published Online: August 6, 2021
View Article titled, Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment
Open the PDF for Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment in another window
Topics: Fatigue life, Random vibration, Safety, Solder joints, Ball-Grid-Array packaging
Journal Articles

Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations

Matthew Ernst, Ed Habtour, Abhijit Dasgupta, Michael Pohland, Mark Robeson, Mark Paulus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011009.
Paper No: EP-14-1062
https://doi.org/10.1115/1.4028516
Published Online: October 15, 2014
View Article titled, Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations
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Topics: Durability, Excitation, Vibration, Inductors, Random vibration, Printed circuit boards, Electronic components, Failure
Journal Articles

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

Sony Mathew, Diganta Das, Michael Osterman, Michael Pecht, Robin Ferebee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 339–345.
https://doi.org/10.1115/1.2351897
Published Online: January 8, 2006
View Article titled, Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board
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Topics: Aluminum, Damage, Life testing, Shock (Mechanics), Stress, Vibration, Testing, Printed circuit boards, Cycles, Failure
Journal Articles

A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load

Ron S. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. December 2001, 123(4): 394–400.
https://doi.org/10.1115/1.1372318
Published Online: May 6, 1999
View Article titled, A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load
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Topics: Damage, Electronic components, Failure mechanisms, Fatigue, Finite element analysis, Stress, Vibration, Design, Reliability, Random vibration
Journal Articles

Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading

K. Darbha, S. Ling, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 183–188.
https://doi.org/10.1115/1.2792232
Published Online: September 1, 1997
View Article titled, Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading
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Topics: Stress analysis (Engineering), Surface mount packaging, Printed circuit boards, Solder joints, Stress, Vibration, Boundary-value problems, Damage, Deformation, Fatigue
Journal Articles

Structural Analyses of Spacecraft Electronic Packages

S. Kannappan, V. Kunukkassril
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1992, 114(1): 96–99.
https://doi.org/10.1115/1.2905449
Published Online: March 1, 1992
View Article titled, Structural Analyses of Spacecraft Electronic Packages
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Topics: Electronic packages, Space vehicles, Structural analysis, Finite element methods, Stress, Computer software, Design, Electronics, Manufacturing, Modal analysis