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Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041012.
Paper No: EP-13-1130
https://doi.org/10.1115/1.4028332
Published Online: September 19, 2014
View Article titled, Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
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Topics: Cavities, Columns (Structural), Copper, Evaporation, Fillers (Materials), Nanoparticles, Particulate matter, Self-assembly, Silver, Temperature
Journal Articles

Impact of Self-Assembly Process Errors on Thermoelectric Performance

Nathan B. Crane, Patrick McKnight
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031001.
https://doi.org/10.1115/1.4006709
Published Online: July 18, 2012
View Article titled, Impact of Self-Assembly Process Errors on Thermoelectric Performance
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Topics: Errors, Manufacturing, Self-assembly, Thermal conductivity, Probability, Redundancy (Engineering), Simulation, Temperature, Junctions, Heat
Journal Articles

Vacuum Packaging of MEMS by Self-Assembly

Royi Naveh, Eyal Zussman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021003.
https://doi.org/10.1115/1.4006138
Published Online: June 11, 2012
View Article titled, Vacuum Packaging of MEMS by Self-Assembly
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Topics: Cavities, Self-assembly, Solders, Vacuum, Sealing (Process), Manufacturing, Stability, Surface tension, Microelectromechanical systems, Shear (Mechanics)
Journal Articles

Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials

Lin Hu, William Evans, Pawel Keblinski
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021002.
https://doi.org/10.1115/1.4003865
Published Online: June 22, 2011
View Article titled, Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials
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Topics: Composite materials, Nanoparticles, Particulate matter, Simulation, Thermal conductivity, Wetting, Self-assembly, Molecular dynamics simulation
Journal Articles

Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly

M. Mastrangeli, K. Jans, T. Steylaerts, C. Van Hoof, J.-P. Celis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041008.
https://doi.org/10.1115/1.4002725
Published Online: November 24, 2010
View Article titled, Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly
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Topics: Coating processes, Coatings, Electronic packaging, Self-assembly, Fluids, Water, Hydrophobicity
Journal Articles

Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect

Cheng Lin, Fangang Tseng, Ching-Chang Chieng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021005.
https://doi.org/10.1115/1.2912216
Published Online: April 25, 2008
View Article titled, Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect
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Topics: Lubricants, Self-assembly, Water, Solders, Adhesives, Manufacturing
Journal Articles

Resin Self-Alignment Processes for Self-Assembly Systems

Jong-Min Kim, Kiyokazu Yasuda, Kozo Fujimoto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 18–24.
https://doi.org/10.1115/1.1846061
Published Online: March 21, 2005
View Article titled, Resin Self-Alignment Processes for Self-Assembly Systems
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Topics: Resins, Surface tension, Self-assembly