1-20 of 27
Shock (Mechanics)
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Hisham Abusalma, Hayden Richards, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Jian Yu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041119.
Paper No: EP-24-1050
https://doi.org/10.1115/1.4066320
Published Online: September 12, 2024
View Article titled, Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
Open the PDF for Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes in another window
Topics: Aerosols, Cantilevers, Durability, Extruding, Finite element analysis, Silver, Testing, Printing, Shock (Mechanics), Strain gages
Journal Articles

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031006.
Paper No: EP-22-1025
https://doi.org/10.1115/1.4064521
Published Online: March 11, 2024
View Article titled, Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging
Open the PDF for Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging in another window
Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Viscoplasticity, Finite element analysis
Journal Articles

Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021004.
Paper No: EP-22-1026
https://doi.org/10.1115/1.4062868
Published Online: November 10, 2023
View Article titled, Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method
Open the PDF for Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method in another window
Topics: Solders, Temperature, Shock (Mechanics), Alloys
Journal Articles

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

T.-C. Huang, K.-C. Liao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011206.
Paper No: EP-22-1010
https://doi.org/10.1115/1.4054822
Published Online: August 3, 2022
View Article titled, Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks
Open the PDF for Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks in another window
Topics: Shock (Mechanics), Contact resistance, Displacement
Journal Articles

Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

Phil Geng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2019, 141(1): 010801.
Paper No: EP-18-1046
https://doi.org/10.1115/1.4042800
Published Online: February 25, 2019
View Article titled, Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention
Open the PDF for Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention in another window
Topics: Design, Shock (Mechanics), Solder joints, Stress, Structural design, Vibration, Failure, Creep
Journal Articles

Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition

Guicui Fu, Maogong Jiang, Bo Wan, Yanruoyue Li, Cheng Ma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011004.
Paper No: EP-18-1055
https://doi.org/10.1115/1.4041984
Published Online: February 25, 2019
View Article titled, Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition
Open the PDF for Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition in another window
Topics: Bonding, Shock (Mechanics), Wire, Risk assessment
Journal Articles

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

Sharan Kallolimath, Jiang Jenny Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041001.
Paper No: EP-14-1082
https://doi.org/10.1115/1.4034187
Published Online: August 10, 2016
View Article titled, Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response
Open the PDF for Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response in another window
Topics: Electrons, Finite element analysis, Lumber, Shock (Mechanics), Simulation, Stress, Solder joints, Modeling, Symmetry (Physics), Boundary-value problems
Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
https://doi.org/10.1115/1.4028641
Published Online: March 1, 2015
View Article titled, Stress–Strain Behavior of SAC305 at High Strain Rates
Open the PDF for Stress–Strain Behavior of SAC305 at High Strain Rates in another window
Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
Open the PDF for Special Section on InterPACK 2013 in another window
Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting Materials

S. A. Meguid, Chen Zhuo, Fan Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041010.
Paper No: EP-13-1102
https://doi.org/10.1115/1.4026542
Published Online: September 19, 2014
View Article titled, Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting Materials
Open the PDF for Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting Materials in another window
Topics: Design, Shock (Mechanics), Stress
Journal Articles

Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal Modules

Se-Chang Kim, Dae-Geun Cho, Tae-Gyu Kim, Se-Hun Jung, Ja-Choon Koo, Moon-Ki Kim, Jae-Boong Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041001.
Paper No: EP-13-1004
https://doi.org/10.1115/1.4024748
Published Online: August 7, 2013
View Article titled, Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal Modules
Open the PDF for Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal Modules in another window
Topics: Finite element analysis, Finite element model, Shock (Mechanics), Impact testing, Packaging
Journal Articles

Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact

Pradeep Lall, Ryan Lowe, Kai Goebel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021001.
https://doi.org/10.1115/1.4006706
Published Online: June 11, 2012
View Article titled, Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact
Open the PDF for Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact in another window
Topics: Damage, Electronics, Failure, Shock (Mechanics), Solders, Spectroscopy, Vibration, Signals, Phase shift, Stress
Journal Articles

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

P. Tumne, V. Venkatadri, S. Kudtarkar, M. Delaus, D. Santos, R. Havens, K. Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020905.
https://doi.org/10.1115/1.4005906
Published Online: June 11, 2012
View Article titled, Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages
Open the PDF for Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages in another window
Topics: Alloys, Design, Failure, Failure mechanisms, Intermetallic compounds, Reliability, Semiconductor wafers, Solders, Separation (Technology), Shock (Mechanics)
Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041012.
https://doi.org/10.1115/1.4005091
Published Online: December 9, 2011
View Article titled, Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results
Open the PDF for Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results in another window
Topics: Damping, Finite element analysis, Modeling, Printed circuit boards, Shock (Mechanics), Manufacturing, Simulation, Simulation results, Cycles, Materials properties
Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041010.
https://doi.org/10.1115/1.4005090
Published Online: December 9, 2011
View Article titled, Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results
Open the PDF for Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results in another window
Topics: Printed circuit boards, Shock (Mechanics), Manufacturing
Journal Articles

Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

A. D. Laws, R. Borwick, III, P. Stupar, J. DeNatale, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041005.
https://doi.org/10.1115/1.4000211
Published Online: October 21, 2009
View Article titled, Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock
Open the PDF for Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock in another window
Topics: Design, Physics, Atomic clocks, Temperature, Thermal resistance, Shock (Mechanics), Finite element analysis, Structural analysis
Journal Articles

An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads

Fadi Alsaleem, Mohammad I. Younis, Ronald Miles
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031002.
https://doi.org/10.1115/1.2957319
Published Online: July 29, 2008
View Article titled, An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads
Open the PDF for An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads in another window
Topics: Microelectromechanical systems, Shock (Mechanics), Stress, Manufacturing, Diaphragms (Mechanical devices), Diaphragms (Structural)
Journal Articles

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 373–381.
https://doi.org/10.1115/1.2804085
Published Online: March 25, 2007
View Article titled, Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
Open the PDF for Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages in another window
Topics: Ball-Grid-Array packaging, Displacement, Errors, Finite element model, Reliability, Shells, Shock (Mechanics), Transients (Dynamics), Dynamics (Mechanics), Modeling
Journal Articles

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

Sony Mathew, Diganta Das, Michael Osterman, Michael Pecht, Robin Ferebee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 339–345.
https://doi.org/10.1115/1.2351897
Published Online: January 8, 2006
View Article titled, Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board
Open the PDF for Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board in another window
Topics: Aluminum, Damage, Life testing, Shock (Mechanics), Stress, Vibration, Testing, Printed circuit boards, Cycles, Failure
Journal Articles

Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

Rashed Adnan Islam, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 375–380.
https://doi.org/10.1115/1.2056570
Published Online: February 14, 2005
View Article titled, Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock
Open the PDF for Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock in another window
Topics: Anisotropy, Contact resistance, Shock (Mechanics), Particulate matter, Abrasion