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Journal Articles

Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling

Wan-Chun Chuang, Wei-Long Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011007.
Paper No: EP-19-1042
https://doi.org/10.1115/1.4044489
Published Online: October 10, 2019
View Article titled, Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling
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Topics: Cycles, Fatigue life, Semiconductor wafers, Simulation models, Solders, Stress, Temperature, Creep, Assembly lines, Simulation results
Journal Articles

Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module

C. Beckermann, T. F. Smith, B. Pospichal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 126–133.
https://doi.org/10.1115/1.2905500
Published Online: June 1, 1994
View Article titled, Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module
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Topics: Simulation models, Thermal analysis, Heat transfer, Radiation (Physics), Air flow, Convection, Drag (Fluid dynamics), Geometry, Heat conduction, Heat losses