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Journal Articles

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

Jinxin Liu, Zhiheng Huang, Paul P. Conway, Yang Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011009.
Paper No: EP-19-1058
https://doi.org/10.1115/1.4044648
Published Online: October 10, 2019
View Article titled, Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions
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Topics: Grain size, Shear (Mechanics), Simulation, Deformation, Reliability, Atoms, Simulation results, Copper
Journal Articles

Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling

Wan-Chun Chuang, Wei-Long Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011007.
Paper No: EP-19-1042
https://doi.org/10.1115/1.4044489
Published Online: October 10, 2019
View Article titled, Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling
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Topics: Cycles, Fatigue life, Semiconductor wafers, Simulation models, Solders, Stress, Temperature, Creep, Assembly lines, Simulation results
Journal Articles

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Hyoungsoon Lee, Damena D. Agonafer, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010907.
Paper No: EP-15-1104
https://doi.org/10.1115/1.4032655
Published Online: March 10, 2016
View Article titled, Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices
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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Flux (Metallurgy), Gallium nitride, Heat conduction, Heat transfer coefficients, Microchannels, Microcoolers, Simulation
Journal Articles

Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model

Wei Han, Marc Rensing, Peter O’Brien, Frank H. Peters
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044502.
https://doi.org/10.1115/1.4005292
Published Online: December 9, 2011
View Article titled, Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model
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Topics: Lasers, Manufacturing, Microwaves, Optimization, Packaging, Reflection, Resonance, Strip transmission lines, Simulation results, Simulation
Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041012.
https://doi.org/10.1115/1.4005091
Published Online: December 9, 2011
View Article titled, Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results
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Topics: Damping, Finite element analysis, Modeling, Printed circuit boards, Shock (Mechanics), Manufacturing, Simulation, Simulation results, Cycles, Materials properties
Journal Articles

Thermal Placement Design for MCM Applications

Yu-Jung Huang, Shen-Li Fu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 115–120.
https://doi.org/10.1115/1.483142
Published Online: November 9, 1999
View Article titled, Thermal Placement Design for MCM Applications
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Topics: Algorithms, Design, Energy dissipation, Finite element analysis, Multi-chip modules, Simulation results, Reliability, Heat, Thermal management, Temperature distribution
Journal Articles

The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints

S. Rzepka, M. A. Korhonen, E. Meusel, C.-Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 342–348.
https://doi.org/10.1115/1.2792644
Published Online: December 1, 1998
View Article titled, The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints
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Topics: Delamination, Flip-chip, Solder joints, Thermal stresses, Solders, Stress, Adhesion, Damage, Failure, Finite element analysis
Journal Articles

Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package

B. Nagaraj, M. Mahalingam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 290–295.
https://doi.org/10.1115/1.2792635
Published Online: September 1, 1998
View Article titled, Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package
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Topics: Reliability, Temperature, Solders, Cycles, Finite element methods, Simulation, Creep, Failure, Simulation results, Ball-Grid-Array packaging
Journal Articles

Optimization of Wire Loop Height for a Cavity Down Plastic Pin Grid Array Package

I. Chaudhry, F. Barez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1998, 120(2): 194–200.
https://doi.org/10.1115/1.2792620
Published Online: June 1, 1998
View Article titled, Optimization of Wire Loop Height for a Cavity Down Plastic Pin Grid Array Package
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Topics: Cavities, Optimization, Wire, Temperature, Cycles, Finite element model, Simulation results, Stress, Failure mechanisms, Simulation
Journal Articles

A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints

T. Reinikainen, M. Poech, M. Krumm, J. Kivilahti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 106–113.
https://doi.org/10.1115/1.2792277
Published Online: March 1, 1998
View Article titled, A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints
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Topics: Experimental analysis, Finite element analysis, Shear (Mechanics), Solder joints, Stress concentration, Creep, Simulation results, Stress, Alloys, Deformation
Journal Articles

Strength Analysis of Surface Mounted Assemblies Under Bending and Twisting Loads

Tin-Lup Wong, Karl K. Stevens, Junshi Wang, Wayne Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 168–174.
https://doi.org/10.1115/1.2904358
Published Online: June 1, 1990
View Article titled, Strength Analysis of Surface Mounted Assemblies Under Bending and Twisting Loads
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Topics: Stress, Deflection, Deformation, Engineering simulation, Experimental analysis, Failure, Simulation, Simulation results