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Journal Articles

Effect of Design Parameters on Thermomechanical Stress in Silicon of Through-Silicon Via

Joo-Sun Hwang, Seung-Ho Seo, Won-Jun Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031006.
Paper No: EP-15-1054
https://doi.org/10.1115/1.4033923
Published Online: June 28, 2016
View Article titled, Effect of Design Parameters on Thermomechanical Stress in Silicon of Through-Silicon Via
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Topics: Copper, Design, Silicon, Stress, Thermomechanics, Stress concentration, Annealing, Yield stress
Journal Articles

Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020903.
https://doi.org/10.1115/1.4006515
Published Online: June 11, 2012
View Article titled, Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package
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Topics: Finite element methods, Silicon, Silicon chips, Simulation, Stress, System-in-package, Thermal stresses, Temperature, Stress concentration
Journal Articles

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure

Hideo Koguchi, Kazuhisa Hoshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020902.
https://doi.org/10.1115/1.4006139
Published Online: June 11, 2012
View Article titled, Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure
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Topics: Bonding, Boundary element methods, Delamination, Resins, Stress, Stress singularity, Silicon, Joining, Stress concentration
Journal Articles

The Thermoelastic Analysis of Chip-Substrate System

Linzhi Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 325–332.
https://doi.org/10.1115/1.1772413
Published Online: October 6, 2004
View Article titled, The Thermoelastic Analysis of Chip-Substrate System
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Topics: Fourier series, Heat conduction, Integrated circuits, Stress, Temperature, Thermal stresses, Thermoelasticity, Stress concentration, Reliability, Heat
Journal Articles

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders S. G. Andræ, Gang Zou, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
https://doi.org/10.1115/1.1648057
Published Online: July 8, 2004
View Article titled, Characterization of Substrate Materials for System-in-a-Package Applications
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Topics: Ceramics, Cooling, Density, Epoxy resins, Finite element methods, Manufacturing, Microwaves, Reliability, System-in-package, Thermal expansion
Journal Articles

Failure Analysis of Full Delamination on the Stacked Die Leaded Packages

T. Y. Lin, Z. P. Xiong, Y. F. Yao, Lane Tok, Z. Y. Yu, Budi Njoman, K. H. Chua, Y. Y. Ma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 392–399.
https://doi.org/10.1115/1.1602704
Published Online: September 17, 2003
View Article titled, Failure Analysis of Full Delamination on the Stacked Die Leaded Packages
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Topics: Delamination, Finite element analysis, Stress concentration, Failure analysis, Adhesion
Journal Articles

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Xia Cai, Liu Chen, Qun Zhang, Bulu Xu, Weidong Huang, Xiaoming Xie, Zhaonian Cheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 84–92.
https://doi.org/10.1115/1.1533802
Published Online: March 14, 2003
View Article titled, Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies
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Topics: Finite element analysis, Flip-chip assemblies, Simulation, Solder joints, Solders, Stress, Deformation, Cycles, Flip-chip packages, Thermal expansion
Journal Articles

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Noriyasu Kawamura, Takashi Kawakami, Kikuo Kishimoto, Masaki Omiya, Toshikazu Shibuya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 323–327.
https://doi.org/10.1115/1.1501304
Published Online: December 12, 2002
View Article titled, Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin
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Topics: Fracture (Materials), Fracture (Process), Fracture toughness, Resins, Semiconductors (Materials), Stress, Temperature, Stress concentration, Finite element analysis, Delamination
Journal Articles

Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry

Keith B. Bowman, David H. Mollenhauer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 340–344.
https://doi.org/10.1115/1.1497627
Published Online: December 12, 2002
View Article titled, Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry
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Topics: Interferometry, Polymers, Residual stresses, Stress, Laminates, Temperature, Displacement, Stress concentration
Journal Articles

Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

Q. Yao, J. Qu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 196–201.
https://doi.org/10.1115/1.2792684
Published Online: September 1, 1999
View Article titled, Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages
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Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect
Journal Articles

Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw

F. Yang, I. Kao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 191–195.
https://doi.org/10.1115/1.2792683
Published Online: September 1, 1999
View Article titled, Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw
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Topics: Abrasive machining, Semiconductor wafers, Stress, Abrasives, Manufacturing, Pressure, Shear stress, Slurries, Wire, Cutting
Journal Articles

Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

Cemal Basaran, Assoc. Prof. and Director,, Ying Zhao, Senior Reliability Engineer,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 218–224.
https://doi.org/10.1115/1.1362674
Published Online: July 6, 1999
View Article titled, Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging
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Topics: Adhesives, Damage, Elastic analysis, Finite element analysis, Stress, Stress concentration, Electronic packaging, Shear stress, Stress singularity
Journal Articles

Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package

B. Nagaraj, M. Mahalingam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 290–295.
https://doi.org/10.1115/1.2792635
Published Online: September 1, 1998
View Article titled, Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package
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Topics: Reliability, Temperature, Solders, Cycles, Finite element methods, Simulation, Creep, Failure, Simulation results, Ball-Grid-Array packaging
Journal Articles

Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

J. Li, I. Kao, V. Prasad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 123–128.
https://doi.org/10.1115/1.2792595
Published Online: June 1, 1998
View Article titled, Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production
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Topics: Modeling, Semiconductor wafers, Stress, Wire, Particulate matter, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries
Journal Articles

A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints

T. Reinikainen, M. Poech, M. Krumm, J. Kivilahti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 106–113.
https://doi.org/10.1115/1.2792277
Published Online: March 1, 1998
View Article titled, A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints
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Topics: Experimental analysis, Finite element analysis, Shear (Mechanics), Solder joints, Stress concentration, Creep, Simulation results, Stress, Alloys, Deformation
Journal Articles

Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw

R. K. Sahoo, V. Prasad, I. Kao, J. Talbott, K. P. Gupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 35–40.
https://doi.org/10.1115/1.2792283
Published Online: March 1, 1998
View Article titled, Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw
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Topics: Design, Semiconductor wafers, Wire, Cutting, Algorithms, Feedback, Finishes, Finite element methods, Fracture (Materials), Fracture (Process)
Journal Articles

Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading

J. W. Tierney, J. W. Eischen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 281–287.
https://doi.org/10.1115/1.2792250
Published Online: December 1, 1997
View Article titled, Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading
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Topics: Algebra, Equilibrium (Physics), Finite element analysis, Microelectronic devices, Stress, Stress analysis (Engineering), Stress concentration, Strips
Journal Articles

Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)

R. C. Dunne, S. K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 197–203.
https://doi.org/10.1115/1.2792234
Published Online: September 1, 1997
View Article titled, Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)
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Topics: Stress concentration, Warping, Thermomechanics, Delamination, Design, Dielectric materials, Electronic components, Failure, Shear (Mechanics), Stress
Journal Articles

Thermal Stresses in Layered Electronic Assemblies

Z. Q. Jiang, Y. Huang, A. Chandra
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 127–132.
https://doi.org/10.1115/1.2792218
Published Online: June 1, 1997
View Article titled, Thermal Stresses in Layered Electronic Assemblies
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Topics: Thermal stresses, Adhesives, Design, Stress, Electronic packages, Electronics, Euler-Bernoulli beam theory, Failure, Finite element analysis, Finite element methods
Journal Articles

Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach

K. X. Hu, Y. Huang, C. P. Yeh, K. W. Wyatt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 87–93.
https://doi.org/10.1115/1.2792137
Published Online: June 1, 1996
View Article titled, Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach
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Topics: Micromechanics (Engineering), Printed circuit boards, Solder joints, Stress analysis (Engineering), Lumber, Accounting, Composite materials, Energy budget (Physics), Finite element analysis, Stress concentration