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Journal Articles

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Chong Ye, Charles I. Ume, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021007.
Paper No: EP-19-1085
https://doi.org/10.1115/1.4046163
Published Online: March 9, 2020
View Article titled, Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics
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Topics: Carbon, Electronics, Finite element analysis, Polymers, Strips, Simulation, Textiles, Mechanical properties
Journal Articles

Investigation of Strip Warpage Behavior in Wire Bonding Process

Wan-Chun Chuang, Wei-Long Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021002.
Paper No: EP-19-1067
https://doi.org/10.1115/1.4045362
Published Online: February 3, 2020
View Article titled, Investigation of Strip Warpage Behavior in Wire Bonding Process
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Topics: Strips, Temperature, Warping, Molding, Assembly lines
Journal Articles

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

Youmin Yu, Victor Chiriac, Yingwei Jiang, Zhijie Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021013.
Paper No: EP-13-1015
https://doi.org/10.1115/1.4029569
Published Online: June 1, 2015
View Article titled, Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids
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Topics: Heat transfer, Optimization, Solders, Strips, Reflow soldering
Journal Articles

Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution

Jun Jie Liu, Hua Zhang, S. C. Yao, Yubai Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021008.
Paper No: EP-13-1129
https://doi.org/10.1115/1.4027420
Published Online: April 29, 2014
View Article titled, Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution
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Topics: Boiling, Cooling, Flow (Dynamics), Heat flux, Heat transfer, Microchannels, Modeling, Porous materials, Pressure drop, Temperature
Journal Articles

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

Bengt Sundén, Gongnan Xie
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2014, 136(2): 024501.
Paper No: EP-13-1058
https://doi.org/10.1115/1.4026538
Published Online: April 29, 2014
View Article titled, Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink
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Topics: Cooling, Heat, Heat sinks, Strips, Temperature, Thermal analysis, Thermal resistance, Electrical conductance, Invar, Temperature distribution
Journal Articles

A Novel Low Cost Package for Radio Frequency Applications

Sandeep Chaturvedi, Shiban K. Koul
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2013, 135(2): 024501.
Paper No: EP-11-1096
https://doi.org/10.1115/1.4023041
Published Online: March 28, 2013
View Article titled, A Novel Low Cost Package for Radio Frequency Applications
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Topics: Design, Laminates, Manufacturing, Simulation, Strip transmission lines, Strips
Journal Articles

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

X. Zhao, M. Saka, M. Yamashita, F. Togoh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021003.
https://doi.org/10.1115/1.4001687
Published Online: June 11, 2010
View Article titled, Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films
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Topics: Current density, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion, Grain size, Temperature, Sputtering (Irradiation), Circuits, Damage, Strips
Journal Articles

Flip-Chip Interconnect for Coplanar Strip Lines

Young K. Song, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044501.
https://doi.org/10.1115/1.2993140
Published Online: November 17, 2008
View Article titled, Flip-Chip Interconnect for Coplanar Strip Lines
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Topics: Flip-chip, Strips, Circuits, Solders, Signals, Waveguides
Journal Articles

Simultaneous Electrothermal Test Method for Pyroelectric Microsensors

Brian Smith, Cristina Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 504–511.
https://doi.org/10.1115/1.2804101
Published Online: August 19, 2007
View Article titled, Simultaneous Electrothermal Test Method for Pyroelectric Microsensors
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Topics: Heat, Manufacturing, Sensors, Temperature, Thermal conductivity, Thermal diffusion, Thermal properties, Boundary-value problems, Microsensors, Strips
Journal Articles

Singulation of Electronic Packages With Abrasive Waterjets

Mohamed Hashish
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2006, 128(4): 479–483.
https://doi.org/10.1115/1.2353328
Published Online: February 9, 2006
View Article titled, Singulation of Electronic Packages With Abrasive Waterjets
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Topics: Cutting, Strips, Nozzles, Machinery, Flow (Dynamics)
Journal Articles

Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications

Man-Lung Sham, Jang-Kyo Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 47–51.
https://doi.org/10.1115/1.1849232
Published Online: March 21, 2005
View Article titled, Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications
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Topics: Residual stresses, Resins, Strips, Numerical analysis, Temperature, Finite element analysis, Stress
Journal Articles

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

Mitul Modi, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 301–307.
https://doi.org/10.1115/1.1772410
Published Online: October 6, 2004
View Article titled, Interfacial Fracture Toughness Measurement of a Ti/Si Interface
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Topics: Fracture toughness, Stress, Titanium, Silicon, Fracture (Materials), Delamination, Metals, Adhesion, Strips, Adhesives
Journal Articles

Submodeling Analysis for Path-Dependent Thermomechanical Problems

Tong Hong Wang, Yi-Shao Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 135–140.
https://doi.org/10.1115/1.1869513
Published Online: September 28, 2004
View Article titled, Submodeling Analysis for Path-Dependent Thermomechanical Problems
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Topics: Fatigue, Fatigue life, Finite element analysis, Solders, Stress, Thermomechanics, Strips, Electronic packages
Journal Articles

Interfacial Stress Analysis and Fracture of a Bi-Material Strip With a Heterogeneous Underfill

Ji Eun Park, Iwona Jasiuk, Aleksander Zubelewicz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 400–413.
https://doi.org/10.1115/1.1602480
Published Online: September 17, 2003
View Article titled, Interfacial Stress Analysis and Fracture of a Bi-Material Strip With a Heterogeneous Underfill
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Topics: Particulate matter, Stress, Fracture (Materials), Fracture (Process), Strips
Journal Articles

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

Alfonso Ortega, Shankar Ramanathan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 226–234.
https://doi.org/10.1115/1.1569506
Published Online: June 10, 2003
View Article titled, On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources
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Topics: Cooling, Flow (Dynamics), Heat, Strips, Temperature, Wakes, Electronic components, Turbulence
Journal Articles

Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip Assemblies

Ji Eun Park, Iwona Jasiuk, Mem. ASME,, Alek Zubelewicz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 44–52.
https://doi.org/10.1115/1.1527656
Published Online: March 14, 2003
View Article titled, Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip Assemblies
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Topics: Fracture (Materials), Fracture (Process), Particulate matter, Stress, Strips, Flip-chip assemblies
Journal Articles

Damage Accumulation During Stress Relaxation of Polymer Films in Bending

D. Ingman, Y. Michlin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 260–265.
https://doi.org/10.1115/1.1463731
Published Online: July 26, 2002
View Article titled, Damage Accumulation During Stress Relaxation of Polymer Films in Bending
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Topics: Damage, Relaxation (Physics), Stress, Strips, Deformation, Polymer films
Journal Articles

Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array

Wataru Nakayama, Masud Behnia, Hiroaki Mishima
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 132–137.
https://doi.org/10.1115/1.483145
Published Online: February 18, 2000
View Article titled, Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array
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Topics: Boiling, Coolants, Critical heat flux, Flow (Dynamics), Forced convection, Heat transfer, Strips, Subcooling, Temperature, Nozzles
Journal Articles

Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens

W. Ren, Z. Qian, M. Lu, S. Liu, D. Shangguan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 271–274.
https://doi.org/10.1115/1.2793851
Published Online: December 1, 1999
View Article titled, Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens
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Topics: Alloys, Lead-free solders, Strips, Fatigue, Computers, Creep, Electronic packaging, Solders, Testing, Thermomechanics
Journal Articles

Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading

J. W. Tierney, J. W. Eischen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 281–287.
https://doi.org/10.1115/1.2792250
Published Online: December 1, 1997
View Article titled, Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading
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Topics: Algebra, Equilibrium (Physics), Finite element analysis, Microelectronic devices, Stress, Stress analysis (Engineering), Stress concentration, Strips