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Journal Articles

Application of Statistical Clustering to Screen Printing Process Control

V. A. Skormin, C. R. Herman, L. J. Popyack
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 235–240.
https://doi.org/10.1115/1.2792098
Published Online: September 1, 1995
View Article titled, Application of Statistical Clustering to Screen Printing Process Control
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Topics: Performance, Printing, Process control, Surface mount assemblies
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

D. Barker, S. Burchett, H. Conrad, A. Dasgupta, P. Engel, J. Lau, Y. Pao, A. Rafanelli, R. Ross, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1995, 117(2): 93.
https://doi.org/10.1115/1.2792086
Published Online: June 1, 1995
View Article titled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Donald Barker, Hans Conrad, Peter Engel, Tai-Ran Hsu, John Lau, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone, Frank Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1993, 115(2): 139–140.
https://doi.org/10.1115/1.2909308
Published Online: June 1, 1993
View Article titled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies
Journal Articles

Application of Impedance Spectroscopy for On-Line Monitoring of Solder Paste

C. R. Herman, V. A. Skormin, G. R. Westby
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 44–54.
https://doi.org/10.1115/1.2909301
Published Online: March 1, 1993
View Article titled, Application of Impedance Spectroscopy for On-Line Monitoring of Solder Paste
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Topics: Electrochemical impedance spectroscopy, Solders, Manufacturing, Statistical analysis, Statistical process control, Surface mount assemblies
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Donald Barker, Hans Conrad, Peter Engel, John Lan, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1992, 114(2): 103.
https://doi.org/10.1115/1.2906403
Published Online: June 1, 1992
View Article titled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies
Journal Articles

Stress Analysis of the Vertical Interconnect for Three-Dimensional Packaging

K. Zouari, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 233–239.
https://doi.org/10.1115/1.2905400
Published Online: September 1, 1991
View Article titled, Stress Analysis of the Vertical Interconnect for Three-Dimensional Packaging
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Topics: Packaging, Stress analysis (Engineering), Pressure, Blocks (Building materials), Circuits, Design, Electronic systems, Manufacturing, Metals, Plates (structures)
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Peter A. Engel, John H. Lau, Yi-Hsin Pao, Anthony J. Rafanelli, Mohamed Zarrugh, Alex Zubelewicz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1991, 113(2): 91.
https://doi.org/10.1115/1.2905389
Published Online: June 1, 1991
View Article titled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies
Journal Articles

Thermal Stress Analysis of SMT PQFP Packages and Interconnections

J. H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 2–8.
https://doi.org/10.1115/1.3226505
Published Online: March 1, 1989
View Article titled, Thermal Stress Analysis of SMT PQFP Packages and Interconnections
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Topics: Thermal stresses, Manufacturing, Solder joints, Stress, Design, Finite element methods, Mechanical behavior, Reliability, Surface mount assemblies