1-4 of 4
Temperature sensors
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
https://doi.org/10.1115/1.4039026
Published Online: March 2, 2018
View Article titled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
Open the PDF for Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips in another window
Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms
Journal Articles

In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors

Ben-Je Lwo, Jeng-Shian Su, Hsien Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031003.
https://doi.org/10.1115/1.3144149
Published Online: June 23, 2009
View Article titled, In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors
Open the PDF for In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors in another window
Topics: Sensors, Simulation, Stress, Temperature, Packaging, Finite element analysis, Temperature sensors
Journal Articles

Design of Micro-Temperature Sensor Array With Thin Film Thermocouples

Jong-Jin Park, Minoru Taya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 286–289.
https://doi.org/10.1115/1.1997157
Published Online: August 4, 2004
View Article titled, Design of Micro-Temperature Sensor Array With Thin Film Thermocouples
Open the PDF for Design of Micro-Temperature Sensor Array With Thin Film Thermocouples in another window
Topics: Heat conduction, Sensors, Temperature, Thermocouples, Thin films, Copper, Steady state, Heat, Flow (Dynamics), Finite element analysis
Journal Articles

Autoclave Reliability of MEMS Pressure and Temperature Sensors Embedded in Carbon Fiber Composites

Amir Javidinejad, Shiv P. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 79–82.
https://doi.org/10.1115/1.1322563
Published Online: May 26, 2000
View Article titled, Autoclave Reliability of MEMS Pressure and Temperature Sensors Embedded in Carbon Fiber Composites
Open the PDF for Autoclave Reliability of MEMS Pressure and Temperature Sensors Embedded in Carbon Fiber Composites in another window
Topics: Composite materials, Pressure, Pressure sensors, Sensors, Temperature sensors, Carbon fibers, Microelectromechanical systems, Reliability, Cycles