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Journal Articles

Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Kaifeng Chang, Yun-Ze Li, Weishu Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031011.
Paper No: EP-22-1097
https://doi.org/10.1115/1.4062108
Published Online: March 30, 2023
View Article titled, Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope
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Topics: Fibers, Heat, Satellites, Temperature, Temperature control, Thermoelectric coolers, Temperature controls
Journal Articles

Optimization of a Thermoelectric Cooler for Time-Varying Heat Load and Sink Temperature

Matthew R. Pearson, Charles E. Lents
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041010.
Paper No: EP-16-1012
https://doi.org/10.1115/1.4034861
Published Online: October 27, 2016
View Article titled, Optimization of a Thermoelectric Cooler for Time-Varying Heat Load and Sink Temperature
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Topics: Heat, Stress, Temperature, Thermoelectric coolers, Thermal conductivity, Cycles, Electrical conductance
Journal Articles

Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules

Soochan Lee, Patrick E. Phelan, Carole-Jean Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031010.
Paper No: EP-14-1118
https://doi.org/10.1115/1.4030686
Published Online: September 1, 2015
View Article titled, Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules
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Topics: Cooling, Energy generation, Temperature, Thermoelectric coolers, Waste heat, Heat, Reliability, Electronic packaging
Journal Articles

Optimization of Thermoelectric Coolers for Hotspot Cooling in Three-Dimensional Stacked Chips

Matthew Redmond, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011006.
Paper No: EP-14-1013
https://doi.org/10.1115/1.4028254
Published Online: October 6, 2014
View Article titled, Optimization of Thermoelectric Coolers for Hotspot Cooling in Three-Dimensional Stacked Chips
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Topics: Cooling, Optimization, Temperature, Thermoelectric coolers
Journal Articles

Design of Thermoelectric Modules for High Heat Flux Cooling

Ram Ranjan, Joseph E. Turney, Charles E. Lents, Virginia H. Faustino
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041001.
Paper No: EP-13-1073
https://doi.org/10.1115/1.4028118
Published Online: September 19, 2014
View Article titled, Design of Thermoelectric Modules for High Heat Flux Cooling
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Topics: Cooling, Design, Heat, Heat flux, Packing (Shipments), Packings (Cushioning), Temperature, Geometry, Thermal resistance, Thermoelectric coolers
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

3D Compact Model of Packaged Thermoelectric Coolers

Owen Sullivan, Borislav Alexandrov, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031006.
Paper No: EP-13-1006
https://doi.org/10.1115/1.4024653
Published Online: June 24, 2013
View Article titled, 3D Compact Model of Packaged Thermoelectric Coolers
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Topics: Thermoelectric coolers, Cooling, Electronic packages, Steady state, Flat heat pipes
Journal Articles

Array of Thermoelectric Coolers for On-Chip Thermal Management

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021005.
https://doi.org/10.1115/1.4006141
Published Online: June 11, 2012
View Article titled, Array of Thermoelectric Coolers for On-Chip Thermal Management
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Topics: Temperature, Thermoelectric coolers, Steady state, Cooling, Transients (Dynamics), Shapes, Temperature control
Journal Articles

Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System

Huy N. Phan, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031003.
https://doi.org/10.1115/1.4004847
Published Online: September 14, 2011
View Article titled, Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System
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Topics: Cooling, Currents, Design, Heat, Heat sinks, Temperature, Thermoelectric coolers, Thermoelectric cooling, Cooling systems, Computer software
Journal Articles

Solid-State Microrefrigeration in Conjunction With Liquid Cooling

Younes Ezzahri, Ali Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031002.
https://doi.org/10.1115/1.4001853
Published Online: September 8, 2010
View Article titled, Solid-State Microrefrigeration in Conjunction With Liquid Cooling
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Topics: Cooling, Temperature, Thermoelectric coolers, Thin films
Journal Articles

Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers

Huy N. Phan, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2010, 132(2): 024501.
https://doi.org/10.1115/1.4001831
Published Online: June 23, 2010
View Article titled, Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers
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Topics: Cooling, Thermal management, Temperature, Heat sinks, Reliability, Thermoelectric coolers, Air flow
Journal Articles

Numerical Optimization of the Thermoelectric Cooling Devices

Boris Abramzon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 339–347.
https://doi.org/10.1115/1.2753959
Published Online: November 5, 2006
View Article titled, Numerical Optimization of the Thermoelectric Cooling Devices
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Topics: Cooling, Optimization, Temperature, Thermoelectric coolers, Electric current
Journal Articles

Advanced Heat Exchange Technology for Thermoelectric Cooling Devices

R. L. Webb, M. D. Gilley, V. Zarnescu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 98–105.
https://doi.org/10.1115/1.2792292
Published Online: March 1, 1998
View Article titled, Advanced Heat Exchange Technology for Thermoelectric Cooling Devices
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Topics: Heat, Thermoelectric cooling, Thermoelectric coolers, Heat exchangers, Condensers (steam plant), Design, Electronic components, Temperature, Thermal resistance