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Journal Articles

High Temperature Performance Evaluation and Life Prediction for Titanium Modified Silicone Used in Light-Emitting Diodes Chip Scale Packages

Si Yu, Zhen Wang, Jiajie Fan, Cheng Qian, Zhentao Deng, Dayong Gui
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021003.
Paper No: EP-19-1081
https://doi.org/10.1115/1.4045568
Published Online: February 3, 2020
View Article titled, High Temperature Performance Evaluation and Life Prediction for Titanium Modified Silicone Used in Light-Emitting Diodes Chip Scale Packages
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Topics: High temperature, Silicones, Titanium
Journal Articles

Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

H. A. Mustain, William D. Brown, Simon S. Ang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034502.
https://doi.org/10.1115/1.3153582
Published Online: July 14, 2009
View Article titled, Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices
Open the PDF for Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices in another window
Topics: Copper, Diffusion (Physics), Silicon, Silicon nitride ceramics, Tungsten, Annealing, High temperature, Metals, Temperature, Electron spectroscopy
Journal Articles

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

Mitul Modi, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 301–307.
https://doi.org/10.1115/1.1772410
Published Online: October 6, 2004
View Article titled, Interfacial Fracture Toughness Measurement of a Ti/Si Interface
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Topics: Fracture toughness, Stress, Titanium, Silicon, Fracture (Materials), Delamination, Metals, Adhesion, Strips, Adhesives
Journal Articles

Fatigue of Microlithographically-Patterned Free-Standing Aluminum Thin Film Under Axial Stresses

David T. Read, James W. Dally
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 1–6.
https://doi.org/10.1115/1.2792062
Published Online: March 1, 1995
View Article titled, Fatigue of Microlithographically-Patterned Free-Standing Aluminum Thin Film Under Axial Stresses
Open the PDF for Fatigue of Microlithographically-Patterned Free-Standing Aluminum Thin Film Under Axial Stresses in another window
Topics: Aluminum, Fatigue, Stress, Thin films, Cycles, Fatigue life, Fracture (Materials), Titanium, Tensile strength