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Journal Articles

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Michael Deckard, Darin J. Sharar, Michael Fish, Patrick J. Shamberger
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011201.
Paper No: EP-21-1153
https://doi.org/10.1115/1.4054651
Published Online: July 7, 2022
View Article titled, Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat
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Topics: Heat, Phase change materials, Steady state, Temperature, Transients (Dynamics), Melting, Copper, Heat sinks, Tradeoffs, Simulation
Journal Articles

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010910.
Paper No: EP-15-1107
https://doi.org/10.1115/1.4032496
Published Online: March 10, 2016
View Article titled, Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
Open the PDF for Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications in another window
Topics: Cooling, Design, Fins, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer coefficients, Microfluidics, Temperature, Testing
Journal Articles

Trade-off Design of Extruded Heat Sinks Using Mathematical Optimization

D. J. de Kock, J. A. Visser
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 333–341.
https://doi.org/10.1115/1.1772414
Published Online: October 6, 2004
View Article titled, Trade-off Design of Extruded Heat Sinks Using Mathematical Optimization
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Topics: Design, Heat sinks, Optimization, Thermal resistance, Tradeoffs
Journal Articles

Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design

R. K. Agarwal, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 219–224.
https://doi.org/10.1115/1.2909321
Published Online: June 1, 1993
View Article titled, Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design
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Topics: Composite materials, Design, Electrical properties, Printed circuit boards, Textiles, Boundary-value problems, Epoxy adhesives, Epoxy resins, Finite element methods, Glass
Journal Articles

Packaging Architecture Considerations of High Density Multi-Chip Electronic Packages Via System Optimization

J. P. Krusius
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 267–271.
https://doi.org/10.1115/1.2904377
Published Online: September 1, 1990
View Article titled, Packaging Architecture Considerations of High Density Multi-Chip Electronic Packages Via System Optimization
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Topics: Density, Electronic packages, Optimization, Packaging, Complementary metal oxide semiconductors, Cycles, Design, Mechanical engineers, Printed circuit boards, Simulated annealing