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Journal Articles

Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures

Nobuyuki Shishido, Yutaka Hayama, Yuki Akinaga, Shinya Taketomi, Masaaki Koganemaru, Seiya Hagihara, Noriyuki Miyazaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011010.
Paper No: EP-24-1039
https://doi.org/10.1115/1.4066100
Published Online: August 24, 2024
View Article titled, Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
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Topics: Creep, Cycles, Fatigue, Fracture (Materials), Fracture mechanics, Temperature, Wire, Computational methods, Finite element analysis
Journal Articles

Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density

Haibin Zhang, Quan Sun, Zhidan Sun, Yebo Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021006.
Paper No: EP-22-1017
https://doi.org/10.1115/1.4055469
Published Online: September 28, 2022
View Article titled, Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density
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Topics: Current density, Silver, Wire, Temperature gradient, Electrodiffusion
Journal Articles

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020801.
Paper No: EP-20-1074
https://doi.org/10.1115/1.4048038
Published Online: August 27, 2020
View Article titled, Review of Methodologies for Structural Integrity Evaluation of Power Modules
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Topics: Cracking (Materials), Creep, Cycles, Density, Failure, Fatigue, Fracture (Materials), Fracture (Process), Temperature, Wire
Journal Articles

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

Alexander Otto, Sven Rzepka, Bernhard Wunderle
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031012.
Paper No: EP-18-1098
https://doi.org/10.1115/1.4043646
Published Online: June 17, 2019
View Article titled, Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices
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Topics: Cycles, Failure, Junctions, Temperature, Wire, Stress, Failure mechanisms, Thermomechanics
Journal Articles

Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition

Guicui Fu, Maogong Jiang, Bo Wan, Yanruoyue Li, Cheng Ma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011004.
Paper No: EP-18-1055
https://doi.org/10.1115/1.4041984
Published Online: February 25, 2019
View Article titled, Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition
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Topics: Bonding, Shock (Mechanics), Wire, Risk assessment
Journal Articles

A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices

Liang Yin, Christopher Kapusta, Arun Gowda, Kaustubh Nagarkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031009.
Paper No: EP-17-1113
https://doi.org/10.1115/1.4040499
Published Online: July 2, 2018
View Article titled, A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices
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Topics: Overlays (Materials engineering), Packaging, Power semiconductor devices, Reliability, Silicon, Wire, Gates (Closures), Manufacturing, Temperature, Heat sinks
Journal Articles

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2018, 140(1): 017001.
Paper No: EP-17-1111
https://doi.org/10.1115/1.4038735
Published Online: March 2, 2018
View Article titled, Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]
Open the PDF for Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ] in another window
Topics: Bridges (Structures), Electrons, Sensors, Silicon, Stress, Wire
Journal Articles

Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages

Huang-Kuang Kung, Chi-Lung Hsieh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041002.
Paper No: EP-17-1042
https://doi.org/10.1115/1.4037276
Published Online: July 27, 2017
View Article titled, Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages
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Topics: Wire, Deflection
Journal Articles

Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process

Tzeng Yih-Fong, Chen Fu-Chen, Chen Chih-Huang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041004.
Paper No: EP-14-1080
https://doi.org/10.1115/1.4031471
Published Online: October 1, 2015
View Article titled, Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process
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Topics: Ball-Grid-Array packaging, Optimization, Principal component analysis, Shear strength, Wire, Wire bonding, Design, Performance evaluation, Process design
Journal Articles

Modeling and Experimental Study of a Wire Clamp for Wire Bonding

Fuliang Wang, Dengke Fan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011012.
Paper No: EP-14-1035
https://doi.org/10.1115/1.4028836
Published Online: March 1, 2015
View Article titled, Modeling and Experimental Study of a Wire Clamp for Wire Bonding
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Topics: Clamps (Tools), Wire, Wire bonding
Journal Articles

Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method

S. Kim, M. Mayer, J. Persic, J. T. Moon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011002.
Paper No: EP-13-1089
https://doi.org/10.1115/1.4028281
Published Online: October 6, 2014
View Article titled, Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method
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Topics: Temperature, Wire
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Experimental and Modeling Studies of Looping Process for Wire Bonding

Fuliang Wang, Yun Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041009.
Paper No: EP-13-1070
https://doi.org/10.1115/1.4025667
Published Online: November 18, 2013
View Article titled, Experimental and Modeling Studies of Looping Process for Wire Bonding
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Topics: Wire, Materials properties, Finite element model
Journal Articles

Variable-Length Link-Spring Model for Kink Formation During Wire Bonding

Fuliang Wang, Weidong Tang, Junhui Li, Lei Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041004.
Paper No: EP-12-1061
https://doi.org/10.1115/1.4025308
Published Online: September 19, 2013
View Article titled, Variable-Length Link-Spring Model for Kink Formation During Wire Bonding
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Topics: Springs, Wire, Wire bonding, Deformation
Journal Articles

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

C. L. Gan, U. Hashim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021010.
Paper No: EP-12-1099
https://doi.org/10.1115/1.4024013
Published Online: April 12, 2013
View Article titled, Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging
Open the PDF for Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging in another window
Topics: High temperature, Packaging, Reliability, Stress, Wire, Failure mechanisms, Temperature, Semiconductors (Materials), Nanoscale phenomena, Nanoelectronics
Journal Articles

Application of Kriging and Radial Basis Function for Reliability Optimization in Power Modules

Pushparajah Rajaguru, Stoyan Stoyanov, Hua Lu, Chris Bailey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021009.
Paper No: EP-12-1043
https://doi.org/10.1115/1.4024056
Published Online: April 12, 2013
View Article titled, Application of Kriging and Radial Basis Function for Reliability Optimization in Power Modules
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Topics: Aluminum, Design, Optimization, Wire, Warping, Finite element analysis, Reliability, Failure
Journal Articles

Development of Accelerated Method for Thermal Cycling in Electronic Packaging Application

Michael Mayer, Michael McCracken, John Persic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021007.
Paper No: EP-12-1096
https://doi.org/10.1115/1.4023911
Published Online: March 28, 2013
View Article titled, Development of Accelerated Method for Thermal Cycling in Electronic Packaging Application
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Topics: Temperature, Wire, Cycles, Polysilicon
Journal Articles

Direct-Write Stretchable Sensors Using Single-Walled Carbon Nanotube/Polymer Matrix

Morteza Vatani, Yanfeng Lu, Kye-Shin Lee, Ho-Chan Kim, Jae-Won Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011009.
Paper No: EP-12-1041
https://doi.org/10.1115/1.4023293
Published Online: February 26, 2013
View Article titled, Direct-Write Stretchable Sensors Using Single-Walled Carbon Nanotube/Polymer Matrix
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Topics: Sensors, Single-walled carbon nanotubes, Polymers, Wire, Electronics
Journal Articles

Pull Force and Displacement of Cu/Au Wire Interconnects

J. Lau, S. Wu, J. M. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041002.
https://doi.org/10.1115/1.4007233
Published Online: August 29, 2012
View Article titled, Pull Force and Displacement of Cu/Au Wire Interconnects
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Topics: Displacement, Wire
Journal Articles

On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator

Wuwei Feng, Qingfeng Meng, Youbo Xie, Hong Fan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041002.
https://doi.org/10.1115/1.4002900
Published Online: November 19, 2010
View Article titled, On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator
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Topics: Bonding, Feature extraction, Signals, Wire bonding, Generators, Principal component analysis, Wire, Damping, Artificial neural networks, Shear strength