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Journal Articles

Mechanical Design of Electronic Systems

John H. L. Pang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
https://doi.org/10.1115/1.4000755
Published Online: March 19, 2010
View Article titled, Mechanical Design of Electronic Systems
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Topics: Circuits, Design, Design engineering, Electronic systems, Reliability, Testing, Integrated circuits, Circuit design, Integrated circuit packaging, Life testing
Journal Articles

Lead-Free Implementation and Production–A Manufacturing Guide

Anthony J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2007, 129(1): 109–110.
https://doi.org/10.1115/1.2429719
Published Online: March 1, 2007
View Article titled, Lead-Free Implementation and Production–A Manufacturing Guide
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Topics: Manufacturing, Solders
Journal Articles

Electrical Properties of Polymers

Anthony J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2007, 129(1): 111.
https://doi.org/10.1115/1.2429720
Published Online: March 1, 2007
View Article titled, Electrical Properties of Polymers
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Topics: Electrical properties, Polymers
Journal Articles

Practical Guide to the Packaging of Electronics

ANTHONY J. RAFANELLI
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 2005, 127(4): 539.
https://doi.org/10.1115/1.2070094
Published Online: December 1, 2005
View Article titled, Practical Guide to the Packaging of Electronics
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Topics: Electronic packaging, Design
Journal Articles

Environment-Friendly Electronics: Lead-Free Technology

ANTHONY J. RAFANELLI
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 2005, 127(4): 537–538.
https://doi.org/10.1115/1.2070093
Published Online: December 1, 2005
View Article titled, Environment-Friendly Electronics: Lead-Free Technology
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Topics: Alloys, Electronics, Lead-free solders, Solders, Electronic packaging, Soldering, Tin, Low cycle fatigue
Journal Articles

Mechanical Analysis of Electronic Packaging Systems

Stephen A. McKeown,, Author, A. J. Rafanelli,, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2000, 122(1): 73.
https://doi.org/10.1115/1.483132
Published Online: March 1, 2000
View Article titled, Mechanical Analysis of Electronic Packaging Systems
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Topics: Electronic packaging, Engineering education, Integrated circuit packaging, Packaging
Journal Articles

Modern Solder Technology for Competitive Electronics Manufacturing

Jennie S. Hwang, Author, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1997, 119(3): 214–215.
https://doi.org/10.1115/1.2792238
Published Online: September 1, 1997
View Article titled, Modern Solder Technology for Competitive Electronics Manufacturing
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Topics: Electronics, Manufacturing, Solders
Journal Articles

Applied Probability for Engineers and Scientists

Ephraim Suhir, Author, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1997, 119(3): 213–214.
https://doi.org/10.1115/1.2792237
Published Online: September 1, 1997
View Article titled, Applied Probability for Engineers and Scientists
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Topics: Engineers, Probability
Journal Articles

Plastic Encapsulated Microelectronics; Materials, Processes, Quality, Reliability, and Application

Michael G. Pecht, Editor, Luu T. Nguyen, Editor, Edward B. Hakim, Editor, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1997, 119(2): 144–145.
https://doi.org/10.1115/1.2792221
Published Online: June 1, 1997
View Article titled, Plastic Encapsulated Microelectronics; Materials, Processes, Quality, Reliability, and Application
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Topics: Microelectronic devices, Reliability
Journal Articles

Long-Term Non-Operating Reliability of Electronic Products

Judy Pecht, Author, Michael Pecht, Author, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1997, 119(2): 145–146.
https://doi.org/10.1115/1.2792222
Published Online: June 1, 1997
View Article titled, Long-Term Non-Operating Reliability of Electronic Products
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Topics: Electronic products, Reliability
Journal Articles

Taguchi on Robust Technology Development: Bringing Quality Engineering Upstream

Genichi Taguchi, Author, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1994, 116(2): 161.
https://doi.org/10.1115/1.2905506
Published Online: June 1, 1994
View Article titled, Taguchi on Robust Technology Development: Bringing Quality Engineering Upstream
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Topics: Technology development
Journal Articles

Structural Analysis of Printed Circuit Board Systems

Peter A. Engel, Author, J. H. Lau, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1993, 115(3): 343–344.
https://doi.org/10.1115/1.2909340
Published Online: September 1, 1993
View Article titled, Structural Analysis of Printed Circuit Board Systems
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Topics: Printed circuit boards, Structural analysis
Journal Articles

Thermal Stress and Strain in Microelectronics Packaging

John H. Lau, Editor, Peter A. Engel, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1993, 115(3): 343.
https://doi.org/10.1115/1.2909339
Published Online: September 1, 1993
View Article titled, Thermal Stress and Strain in Microelectronics Packaging
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Topics: Microelectronic packaging, Thermal stresses
Journal Articles

Handbook of Tape Automated Bonding

John H. Lau, Editor, William T. Chen, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 1992, 114(4): 480.
https://doi.org/10.1115/1.2905486
Published Online: December 1, 1992
View Article titled, Handbook of Tape Automated Bonding
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Topics: Bonding
Journal Articles

Handbook of Electronic Packaging Design

Michael Pecht, Editor, Hamid A. Hadim, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1992, 114(3): 365.
https://doi.org/10.1115/1.2905466
Published Online: September 1, 1992
View Article titled, Handbook of Electronic Packaging Design
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Topics: Design, Electronic packaging
Journal Articles

Structural Analysis in Microelectronics

E. Suhir, Author, Peter A. Engel, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1992, 114(2): 256.
https://doi.org/10.1115/1.2906427
Published Online: June 1, 1992
View Article titled, Structural Analysis in Microelectronics
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Topics: Microelectronic devices, Structural analysis
Journal Articles

Solder Joint Reliability—Theory and Applications

John H. Lau, Editor, Peter A. Engel, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 1992, 114(1): 100.
https://doi.org/10.1115/1.2905434
Published Online: March 1, 1992
View Article titled, Solder Joint Reliability—Theory and Applications
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Topics: Reliability theory, Solder joints
Journal Articles

The Finite Element in Thermomechanics

Tai-Ran Hsu, Author, J. H. Lau, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1991, 113(3): 329.
https://doi.org/10.1115/1.2905415
Published Online: September 1, 1991
View Article titled, The Finite Element in Thermomechanics
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Topics: Finite element analysis, Thermomechanics
Journal Articles

Surface Mount Technology Materials, Processes, and Equipment

Carmen Capillo, Author, A. J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1991, 113(2): 200.
https://doi.org/10.1115/1.2905388
Published Online: June 1, 1991
View Article titled, Surface Mount Technology Materials, Processes, and Equipment
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Topics: Surface mount technology
Journal Articles

Tribology and Mechanics of Magnetic Storage Devices

Bharat Bhushan, Author, Peter A. Engel, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1990, 112(3): 278.
https://doi.org/10.1115/1.2904379
Published Online: September 1, 1990
View Article titled, Tribology and Mechanics of Magnetic Storage Devices
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Topics: Storage, Tribology