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Keywords: Cu pillar microbumps with printed polymer cores
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031010.
Paper No: EP-20-1102
Published Online: January 19, 2021
... to overcome the limitations in conventional fabrication process. Cylindrical polymer cores with diameter of 20 μ m and height of 30 μ m were successfully printed. Surface metallization was subsequently applied on the printed polymer cores and Cu pillar microbumps with printed polymer cores with diameter of 35...