...Yutaka Kumano; Tetsuyoshi Ogura; Toru Yamada A novel computational fluid dynamics analysis method of predicting semiconductor junction temperatures precisely without modeling printed circuit board (PCB) line patterns was developed. First, PCBs are divided into multiple regions. The effective...

..., and many useful results have been obtained. Regarding mechanical simulation and analysis, there are still two challenges: How to design drop test printed circuit board (PCB) based on dynamic simulation and analysis? How to get accurate elastic modulus of PCB, especially damping parameters, as property...

...Fang Liu; Guang Meng; Mei Zhao Dynamic properties of printed circuit board (PCB) assembly under drop impact are investigated when viscoelasticity of substrate materials is considered. The main materials of a PCB substrate are macromolecule resins, which are typical viscoelastic materials. From...

...Vipin Yadav; Keshav Kant Printed circuit boards (PCBs) with uniform surface temperature and uniform wall heat flux are ideal to study. However, in reality, the heating conditions existing on the PCB surfaces are much different from the ideal ones. Present attempts have been made to study different...