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Keywords: aluminium
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
Published Online: November 24, 2010
... 24 11 2010 aluminium boundary layers computational fluid dynamics contact resistance convection finite volume methods heat sinks metal foams With the development of new high power-density electronics arises the need for more effective means of dissipating the excess heat...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021003.
Published Online: June 11, 2010
... Elements on Electromigration ,” Microelectron. Reliab. 0026-2714 , 38 , pp. 1015 – 1020 . 10.1016/S0026-2714(98)00110-3 20 08 2009 14 04 2010 11 06 2010 11 06 2010 aluminium electromigration sputtering thin film circuits EM high purity Al film grain...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
Published Online: March 27, 2009
... the heat sink itself can be considered a high-conductivity porous medium. In Fig. 9 , we find an increase of more than one order of magnitude in pressure drop due to the addition of the aluminum foam to the finned channels. aluminium computational fluid dynamics finite volume methods forced...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... topography surface morphology adhesion solders scanning electron microscopy X-ray chemical analysis atomic force microscopy focused ion beam technology eutectic alloys lead alloys tin alloys aluminium 03 04 2005 29 11 2005 2006 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 192–201.
Published Online: November 23, 2005
... metallisation materials testing shear deformation nucleation ductile fracture mechanical testing voids (solid) gold copper aluminium fractography shear fracture gold ball bond copper ball bond thermosonic bonding interface In integrated circuit (IC) chip manufacturing, wire bonding...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
Published Online: September 23, 2005
... configuration for even larger enhancement in heat transfer. 25 05 2005 23 09 2005 heat sinks cooling electronics packaging convection porous materials metal foams aluminium Horton , C. W. , and Rogers , F. T. , 1945 , “ Convection Currents in Porous Media ,” J. Appl...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... and Photonic Pacaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received August 3, 2003; revision received June 13, 2004. Review conducted by: P. Lall. 03 August 2003 13 June 2004 03 06 2005 silicon conducting polymers polymer films aluminium...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 342–350.
Published Online: October 6, 2004
... Editor: M. Saka. 01 Oct 2003 01 Feb 2004 06 10 2004 heat sinks flow through porous media permeability aluminium convection Today’s trend in the electronic equipment industry toward denser and more powerful products requires a higher level of performance from cooling...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
Published Online: July 8, 2004
... Editor: B. Sammakia. 01 May 2003 01 December 2003 08 07 2004 heat transfer heat sinks flow through porous media forced convection electronics packaging permeability flow simulation aluminium temperature distribution The trend in electronics industry toward...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 223–234.
Published Online: May 8, 2004
... is produced. Porous Metallic Foam Heat Sink Single Blow Method Transient Liquid Crystal Method Nusselt Number Reynolds Number heat conduction porous materials aluminium foams air forced convection heat sinks modelling flow through porous media 08 04 2004 08 05 2004...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 617–620.
Published Online: December 15, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received February 2003. Associate Editor: E. Suhir. 01 February 2003 15 12 2003 gold copper aluminium integrated circuit interconnections integrated circuit packaging integrated circuit reliability ageing lead bonding hardness...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 597–601.
Published Online: December 15, 2003
... 2003 fine-pitch technology soldering flip-chip devices integrated circuit interconnections integrated circuit packaging aluminium microassembling Since the inception of C4 (controlled collapse chip connection) technology by IBM for their solid logic technology (SLT) more than 40...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 155–163.
Published Online: July 26, 2002
...) forced convection thermal resistance foams porous materials flow through porous media boundary layers cooling aluminium The large-scale integration of electronic circuits has resulted in a continuous increase in chip power dissipation requirements. According to the SIA roadmap 1...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. June 2002, 124(2): 127–134.
Published Online: May 2, 2002
... rough surfaces fracture toughness fracture mechanics failure analysis reliability interface roughness polymers cracks surface topography metals flip-chip devices adhesion aluminium Polymer adhesives are widely used in electronic packaging for both active components (conductive...