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Keywords: automotive electronics
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Journal Articles

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Pradeep Lall, Nokibul Islam, John Evans, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
https://doi.org/10.1115/1.2804086
Published Online: March 7, 2007
.... The measured constitutive behavior has been incorporated into nonlinear finite element simulations. Predictive models have been developed for the dominant failure mechanisms for all the component architectures tested. 29 12 2004 07 03 2007 automotive electronics ball grid arrays chip scale...
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Topics: Ball-Grid-Array packaging, Crack propagation, Cycles, Fracture (Materials), Lumber, Metals, Reliability, Resistors, Solder joints, Printed circuit boards
Journal Articles

Prediction of Thermal Performance of Wire-Bonded Plastic Ball Grid Array Package for Underhood Automotive Applications

K. Ramakrishna, Fellow ASME, J. R. Trent
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 447–455.
https://doi.org/10.1115/1.1602710
Published Online: September 17, 2003
... PACKAGING . Manuscript received Aug. 2001; final revision, Oct. 2002. Associate Editor: B. Courtois. 01 Aug 2001 01 Oct 2002 17 09 2003 automotive electronics ball grid arrays plastic packaging lead bonding thermal conductivity thermal management (packaging) Thermal...
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Topics: Junctions, Molding, Printed circuit boards, Temperature, Thermal conductivity, Natural convection, Wire, Automotive industry, Emissivity
Journal Articles

A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load

Ron S. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. December 2001, 123(4): 394–400.
https://doi.org/10.1115/1.1372318
Published Online: May 6, 1999
.... Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD May 6, 1999. Associate Editor: Yi-Hain Pao. 06 May 1999 automotive electronics plastic packaging fatigue failure analysis vibrations...
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Topics: Damage, Electronic components, Failure mechanisms, Fatigue, Finite element analysis, Stress, Vibration, Design, Reliability, Random vibration