...Chu-Hsuan Sha; Pin J. Wang; Wen P. Lin; Chin C. Lee Silver (Ag) foils are bonded to alumina substrates by a low temperature solid state bonding process. The alumina substrate is premetalized with 40 nm titanium tungsten (TiW) and 2.54 μm gold (Au). The bonding temperature is just 260 °C, compatible...

... g) per column. During bonding, the Ag columns deform and conform to the Cu substrate. They are well bonded to the Cu. No molten phase is involved in the bonding process. The joints consist of pure Ag only. The ductile Ag joints are able to accommodate the thermal expansion mismatch between Si and Cu...

... coefficient matrix in Table 5 is used to calculate the eigenvector vector β j , 6 ( R − λ k I p × p ) β j = 0 ,     i = 1 , 2 , … , m ,     j = 1 , 2 , … , p ,     k = 1 , 2 , … , p bonding processes electronics packaging...

... and testing process. This experiment evaluates the package reliability due to heat and moisture. 16 11 2009 06 07 2010 30 09 2010 30 09 2010 bonding processes light emitting diodes semiconductor device reliability silver thermal management (packaging) high-power LED...

... in warpage introduced by the curing process gave a higher interconnect reliability for the bump bonds. Based on these findings, lower curing temperatures are considered to be more effective for improving the mountability of the package and the interconnect reliability. assembling bonding processes flip...

... chips and Cu substrates. As a demonstration of using the fabricated Ag–Cu dual layer substrate, a fluxless bonding process is developed, which produces high temperature joints with melting temperatures exceeding 695 ° C . Cross-section SEM image of the joint after the annealing step...

... by the current distribution in the plating cell. The deposition is very selective; only occurring on the exposed bond pad metallization. zincation electroless nickel immersion gold (ENIG) under bump metallurgy (UBM) electronics packaging electroless deposition bonding processes surface...

...W. Salalha; E. Zussman; P. Z. Bar-Yoseph An investigation of the flip-chip bonding process for application in MEMS devices was carried out. Finite element analyses of axisymmetric and non-axisymmetric solder joint geometries were performed. It was found that in typical cases of MEMS devices...