... a unified approach toward modeling the behavior including elastic, plastic and creep strains, and microcracking leading to fracture, softening and failure. The test data is used to calibrate for the DSC parameters. Then the model is validated with respect to stress-strain tests and a typical boundary value...

...Ben-Je Lwo, Mem. ASME; Shen-Yu Wu In this work, a simple assembled structure was designed and fabricated so that the calibration procedures on piezoresistive stress sensors for microelectronic packaging can be simpler, more accurate, and more efficient. After comparing with the previous work...

..., temperature sensors as well as heats, and the test wafers were next manufactured through commercialized IC processes. Piezoresistive sensors on silicon strips, which were cut directly from silicon wafers at a specific angle, were then calibrated, and highly consistent piezoresistive coefficients were...

... source, were first designed, then manufactured by a commercialized foundry so that the uniformity of the test chips was expected. Both temperature and stress calibrations were next performed through a special designed MQFP (Metal Quad Flat Package) and four-point bending (4PB) structure, respectively...

... holes are drilled into the specimens and relationships are established, between the released surface displacements and the corresponding residual stress, by introducing a set of calibration coefficients. A multilayer 3D-FEM model is established to determine the relevant calibration coefficients...