...Chu-Hsuan Sha; Chin C. Lee Formation of pure silver (Ag) flip-chip interconnect of silicon (Si) chips on copper (Cu) substrates is reported. Arrays of Ag columns, each 36 μm in height and 40 μm in diameter, are fabricated on 2-in. Si wafers which are first coated with chromium (Cr)/gold (Au) dual...

... aluminium chromium copper heat transfer molecular dynamics method nanoindentation nanotechnology Young's modulus 24 11 2009 17 01 2011 07 06 2011 07 06 2011 2011 American Society of Mechanical Engineers ...

... binding affinity, and the chromium layer has a similar, if not less, binding affinity compared with the silicon chip alone. Thus, this work demonstrates that the fabricated material stack provides an appropriate platform for antigen detection. Change in dynamic parameters of the nanoscale structures...