.... Then, a thermomechanical analysis was carried out based on the temperature distribution from the electrical-thermal analysis. Since crack propagation can change the route of heat transfer, a crack path simulation technique was used to investigate the fracture behavior of the power module. The crack initiates in the solder...

... modeling, that address the nature of the singular solutions at the crack tip and provide insight when dealing with the more complex problem of solder joint fracture. Using three-dimensional finite element analysis of a chip scale package, we systematically examine the stress-strain behavior at the edge...

... application of this technique to overmolded packages. In this study, it is found out that the LGA packages can withstand 1000 temperature cycles without showing crack initiation or other failure mechanisms in the solder joints. The laser ultrasound inspection results match the visual observation and X-ray...

... to obtain the critical material data for this interface, a set of experiments is designed and performed. Due to the brittle failure observed in the experiments, only information about the onset of the delamination is obtained, leading to a crack extension locus. By comparing the experimental results...

.... The oxidized leadframe provided a poor surface to attach adhesive and a higher microstrain on cyclic load, resulting in a negative effect on package reliability, such as a crack phenomenon at the epoxy interface between the die and the leadframe. This occurrence may ultimately cause delamination, which occurs...

... published an article ( 47 ) that correlated the number of cycles to crack initiation, N 0 , and the crack growth rate per cycle, d a / d N , to the strain-energy density (plastic work per unit volume), Δ W , using thermal fatigue test data and ANSYS ® 5.0 FEA software...

...Michael R. Maughan; Robert R. Stephens; Donald M. Blackketter; Karl K. Rink In ongoing research at the University of Idaho, potential failure mechanisms of airbag initiators are being investigated. Cracking of the cylindrical glass-to-metal seal (GTMS) present in these devices has been observed...

... to the underlying circuitry during the wire bonding process. For example, the initial bond force and subsequent ultrasonic vibration may cause cracks within the dielectric layer. The cracks can penetrate through the active circuitry underneath, resulting in electrical failures to the silicon device. In this paper...

...I. Guven, Mem. ASME; V. Kradinov; J. L. Tor; E. Madenci, Mem. ASME This study concerns the prediction of crack growth rate for solder joints in electronic packages under thermal cycling. The crack growth rate, which is dependent on the intrinsic solder property and the current stress state...

...Hai Ding; I. Charles Ume; Cheng Zhang Wafer-level packaging (WLP) is one of the future trends in electronic packaging. Since 1994, many companies have released various WLP licenses. One of the common concerns of WLP is wafer warpage. Warpage of wafers tends to introduce cracking or delamination...

...M. J. Heffes; H. F. Nied This paper examines the modeling of viscoplastic solder behavior in the vicinity of interfacial cracking for flip chip semiconductor packages. Of particular interest is the relationship between viscoplastic deformation in the solder bumps and any possible interface cracking...

... near the crack tip can be used as energy release rate at the interface between chip and underfill. Meanwhile, the delamination propagation rates at the interface was measured by using C-mode scanning acoustic microscope (C-SAM) inspection for two types of flip chip packages under thermal cycle loading...

... failure mode of vertical die cracks. First, the finite element mode (FEM)-based physics of failure models are developed and the reliability of the predicted stress levels was verified by experiments. In the development of reliable thermo-mechanical simulation models, both the process (time and temperature...

...John E. Ritter; G. S. Jacome; J. R. Pelch; T. P. Russell; T. J. Lardner The resistance of silane bonded epoxy/glass interfaces to subcritical crack growth was studied as a function of the density of primary bonds between the silane and epoxy using the double-cleavage drilled compression test (DCDC...

... ,” Int. J. Adhes., Adhes. , 6 ( 3 ), p. 115 115 . Hutchinson, J. W. and Suo, Z., 1991, “Mixed Mode Cracking in Layered Materials,” Advances in Applied Mechanics , Vol. 29, Hutchinson, J. W., and Wu, T. Y., eds., Academic Press, New York. Dundurs , J. , 1969 , “ Edge-bonded dissimilar...

... may cause cracking and delamination leading to the failure or malfunction of electronic assemblies and packages. A simple but accurate engineering approach for the calculation of interlaminar thermal stresses due to thermal mismatch in multi-layered structures is needed so that designers can determine...

...John H. Lau, Fellow ASME; S. W. Ricky Lee, Mem. ASME The popcorning effect of plastic ball grid array (PBGA) packages is analyzed using the method of fracture mechanics. The following three specific problems are studied: (1) crack initiation in the die attach of the package, (2) crack growth...