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1-7 of 7
Keywords: differential scanning calorimetry
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
Published Online: July 31, 2009
...; this was found to be the main source of the extensively formed underfill voiding. This mechanism of chemically and thermally induced voids was explained using void formation study, differential scanning calorimetry thermogram comparison, and gas chromatography and mass spectroscopy chemical composition...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 12–17.
Published Online: March 21, 2005
... paste, the differential scanning calorimetry analysis was carried out. Joint morphology, the formation of conduction path, and the self-organized characteristics were examined. Melting fillers were preserved their initial spherelike form for nonreductive adhesive, although enlargement of the alloy...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 232–236.
Published Online: July 8, 2004
... element analysis calibration materials testing electronics packaging differential scanning calorimetry The compendium paper (Part 1: Models and Testing) presents details of the thermomechanical-digital image correction (TM-DIC) for testing of solders, test plan under variable temperature...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 87–93.
Published Online: April 30, 2004
... received Oct. 2003. Associate Editor: B. Michel. 01 Oct 2003 30 04 2004 gold lead bonding wires (electric) indentation crystal microstructure recrystallisation differential scanning calorimetry hardness elastic moduli yield strength yield stress secondary ion mass spectra...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 371–373.
Published Online: December 12, 2002
... of state extensometers differential scanning calorimetry shrinkage thermal expansion Epoxy molding compound (EMC) is commonly used in the plastic IC encapsulation. This compound is composed of an epoxy resin matrix, curing agents, hardeners, accelerators, etc. EMC is first formed in pellet...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 391–396.
Published Online: December 12, 2002
... 2002 12 12 2002 encapsulation flip-chip devices chip-on-board packaging integrated circuit packaging plastic packaging polymer films heat treatment differential scanning calorimetry The reliability of flip chip on board (FCOB) samples is greatly increased by the introduction...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 268–272.
Published Online: December 22, 1999
... packaging integrated circuit packaging moulding thermal expansion glass transition shear modulus thermal analysis differential scanning calorimetry finite element analysis viscoelasticity Nguyen , L. T. , 1993 , “ Reliability of Postmolded IC Packages ,” ASME J. Electron. Packag...
