... technology finite elements stress analysis micromechanics elastic moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding 12 07 2008 16 09 2009 29 10 2009 2009 American Society of Mechanical...

.... 30 03 2007 10 09 2007 08 05 2008 circuit reliability circuit simulation elastic moduli printed circuit design printed circuit testing solders PCB FE simulation modal test drop test Handheld electronic products such as personal digital assistant and mobile...

... resistance. 17 01 2006 09 09 2007 08 05 2008 adhesive bonding anisotropic media conductive adhesives contact resistance delamination elastic moduli integrated circuit packaging internal stresses resins anisotropic conductive adhesive bonding force adhesion strength...

... stresses stress analysis thermal expansion failure analysis elastic moduli encapsulation bending shrinkage finite element analysis Residual Stress Underfill Resins Bi-Material Strip Bending (BMSB) Finite Element Method Polymeric encapsulant plays a critical role in integrated...

... received Oct. 2003. Associate Editor: B. Michel. 01 Oct 2003 30 04 2004 gold lead bonding wires (electric) indentation crystal microstructure recrystallisation differential scanning calorimetry hardness elastic moduli yield strength yield stress secondary ion mass spectra...

... connection and to achieve reliable thermal fatigue life. surface mount technology integrated circuit packaging plastic packaging viscoelasticity elastic moduli shear modulus elastic deformation finite element analysis Contributed by the Electrical and Electronic Packaging Division...

... polymers moulding thermal stresses integrated circuit packaging plastic packaging integrated circuit reliability thermal expansion compressive strength elastic moduli thermoelasticity The residual thermal stresses in molding compounds affect the mechanical reliability of microelectronic...