...Yuexing Wang; Bofeng Li; Yao Zhifeng; Yao Yao The present investigation delves into the failure model of cracking at the Cu/dielectric interface, specifically at the anode end of a copper interconnect that is triggered by electromigration. The study employs the continuous dislocation model...

...Haibin Zhang; Quan Sun; Zhidan Sun; Yebo Lu The electromigration (EM) damage is becoming a severe problem in the printed flexible electronics as the printed circuits are fabricated thinner and thinner due to the development of printing technology. In this work, the EM behavior of printed silver...

...Mitsuaki Kato; Takahiro Omori; Akihiro Goryu; Tomoya Fumikura; Kenji Hirohata The larger current densities accompanying increased output of power modules are expected to degrade solder joints by electromigration. Although previous research has experimentally studied electromigration in solder, die...

...Mitsuaki Kato; Takahiro Omori; Akihiro Goryu; Tomoya Fumikura; Kenji Hirohata Power modules are being developed to increase power output. The larger current densities accompanying increased power output are expected to degrade solder joints in power modules by electromigration. In previous research...

...Yasuhiro Kimura; Masumi Saka A critical current density, a criterion of electromigration (EM) resistance in interconnects, above which EM damages initiate has been studied to minimize EM damages of interconnects. In general, the assessment of a critical current density is confined to straight...

... of the FEM model. Total solder strain includes the elastic mechanical strain component ɛ ij e and the EM-induced inelastic strain component ɛ ij electromigration . It is written as (3) ɛ ij = ɛ ij e + ɛ ij electromigration...

...Lihua Liang; Yuanxiang Zhang; Yong Liu Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. This paper presents atomic density redistribution algorithm for predicting electromigration induced...

...X. Zhao; M. Saka; M. Yamashita; F. Togoh This paper is focused on evaluating the dominant factor for electromigration (EM) in sputtered high purity Al films. A closed-form equation of atomic flux divergence by treating grain boundary diffusion and hillock formation in a polycrystalline structure...

...JianPing Jing; Lihua Liang; Guang Meng As the electronics industry continues to push for high performance and miniaturization, the demand for higher current densities, which may cause electromigration failures in an IC, interconnects. Electromigration is a phenomenon that metallic atoms...

...Yi-Shao Lai; Ying-Ta Chiu; Chiu-Wen Lee Designed experiments were conducted in this paper to study the effect of Au/Ni/Cu or Cu substrate pad metallization on the electromigration reliability of 96.5Sn–3Ag–0.5Cu flip-chip solder joints with Ti/Ni(V)/Cu under bump metallurgy (UBM) under a current...

...Yi-Shao Lai; Ying-Ta Chiu This work presents electromigration reliability and patterns of Sn–3Ag–0.5Cu and Sn – 3 Ag – 1.5 Cu ∕ Sn – 3 Ag – 0.5 Cu composite flip-chip solder joints with Ti ∕ Ni ( V ) ∕ Cu under bump metallurgy (UBM), bonded on Au ∕ Ni ∕ Cu substrate pads. The solder joints were...

...Hao Lu; Chun Yu; Peilin Li; Junmei Chen The current density distribution in a line-to-bump structure as a function of cross-sectional area ratio of the electrical conductor was investigated, as well as the effects of current crowding on electromigration and interfacial reaction in lead-free solder...

...Yi-Shao Lai; Chiu-Wen Lee; Chin-Li Kao The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue reliability and morphological patterns of three solder compositions...

...C. Basaran; H. Ye; D. C. Hopkins; D. Frear; J. K. Lin The failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different failure modes are reported. Only one of the failure modes is caused by the combined effect of electromigration...