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Keywords: electronics cooling
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031017.
Paper No: EP-21-1164
Published Online: May 19, 2022
.../1.4048493 [34] Zhou , F. , Dede , E. M. , and Joshi , S. N. , 2015 , “ A Novel Design of Hybrid Slot Jet and Mini-Channel Cold Plate for Electronics Cooling ,” 2015 31st Thermal Measurement, Modeling & Management Symposium ( SEMI-THERM ), San Jose, CA, Mar. 15–19, pp. 60...
Journal Articles
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Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
Published Online: June 29, 2020
... of Metallic Phase Change Materials Under Pulsed Power Loading ,” ASME Paper No. IPACK2017-74118. 10.1115/IPACK2017-74118 e-mail:  jaeholee@uci.edu 29 02 2020 16 05 2020 29 06 2020 thermal management electronics cooling heat guiding heterogeneous package...
Journal Articles
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041005.
Paper No: EP-13-1106
Published Online: September 19, 2014
... designs critical for faster penetration of LED systems into general lighting applications. LED cooling natural convection heat sink chimney electronics cooling A19 bulb One particular area of strong interest is adoption of SSL for regular light bulbs. The large number of bulb sockets...
Journal Articles
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024001.
Paper No: EP-13-1081
Published Online: April 29, 2014
... with significantly lower pressure drops. cooling 3D IC review single-phase cooling electronics cooling flow boiling microchannels A 3D IC architecture incorporates multiple device layers that are interconnected through vertical interconnects to extend the performance of a 2D chip. A high level...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021007.
Paper No: EP-13-1082
Published Online: April 29, 2014
... that result in a lower overall temperature difference. Microchannels provide a very high heat transfer coefficient and a small flow passage volume. They have been identified as an effective technique in electronics cooling [ 1–4 ]. Colgan et al. [ 5 ] demonstrated a liquid cooler using offset strip fins...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041004.
Published Online: November 23, 2010
... and development efforts are still on-going, especially in the area of nanocomposites, to deliver technologically viable thermoelectric coolers with an effective Z T > 2 . electronics cooling thermal analysis MEMS cooling electronics packaging 2010 American Society of Mechanical...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021001.
Published Online: May 19, 2010
... blades centrifugal casting cooling fans miniature fans centrifugal flow blade design scaling phenomena electronics cooling Continual advancements in the manufacturing capabilities of microprocessor technologies have resulted in a rapidly expanding portable electronics market...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034501.
Published Online: June 12, 2009
.... convection heat sink metal foam graphite foam electronics cooling Commercially produced metal foams are typically made from aluminum, nickel, steel, copper, and some of their alloys. These materials are known to have high thermal conductivities. This class of porous media has many practical...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
Published Online: February 4, 2008
... enhancement electronics cooling heat spreader experimental Historically the power dissipated from a microprocessor has increased with its computing performance. To slow this trend, microprocessor architectures are being designed with multiple processor cores that are integrated onto a monolithic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 53–60.
Published Online: July 30, 2005
... pressure drop at moderate and high pin spacing, but have only minor influence on heat transfer. 24 10 2004 30 07 2005 thermal management (packaging) integrated circuit packaging heat sinks cooling pin fins heat sink bypass tip leakage electronics cooling Thermal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 61–70.
Published Online: June 14, 2005
... with increasing Re number, pin density, and pin diameter. 13 12 2004 14 06 2005 heat sinks heat transfer jets thermal management (packaging) pin fin heat sinks impinging jet electronics cooling In order to extend the usefulness of direct air cooling in the thermal management...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 178–185.
Published Online: June 10, 2003
... integrated circuit packaging thermal management (packaging) Conduction Electronics Cooling Heat Spreaders Heat Sinks Spreading Resistance Thermal spreading resistance results from discrete heat sources in many engineering systems. Typical applications include cooling of electronic devices...
Topics: Heat, Temperature
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 165–172.
Published Online: December 26, 2000
... their performance to that of single jets at a given flow rate, pressure drop, or pumping power. Jet Impingement Air Jets Multiple Jets Electronics Cooling jets heat transfer confined flow stagnation flow 01 November 1998 26 December 2000 Contributed by the Electronic...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2000, 122(3): 282–285.
Published Online: December 1, 1999
... the greatest surface-to-coolant temperature difference; as the coolant picks up heat from the target, it also speeds up, thus compensating for its expected loss in heat-removal capability. Electronics Cooling Jet Impingement Air Suction Pull and Push Modes Air Jets Confined Jets Heat Sinks Pin...