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Keywords: electronics industry
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021005.
Published Online: June 23, 2010
.... 09 10 2009 26 03 2010 23 06 2010 23 06 2010 cooling electronics industry elemental semiconductors heat pipes microfabrication silicon thermal conductivity thermal resistance microheat pipes electronic cooling thermal conductivity thermal resistance performance...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
Published Online: June 11, 2010
... the chances for TIM delamination. 21 01 2010 06 05 2010 11 06 2010 11 06 2010 assembling ball grid arrays electronics industry finite element analysis moisture polymers reliability thermal management (packaging) thermal resistance thermal interface material debonding...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2004, 126(4): 565–570.
Published Online: January 24, 2005
... management (packaging) semiconductor device packaging product development quality management reliability safety electronics industry Thermal Characterization Compact Modeling Dynamic Measurements Test Dies Reliability Many roadmaps recognize thermal management as one of the major...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 91–95.
Published Online: November 25, 2004
...Andrzej Mościcki; Jan Felba; Tadeusz Sobierajski; Józef Kudzia Pb-free soldering and the use of electrically conducive adhesives in the electronics industry are a segment of the global trend towards a lead-free environment. In comparison to lead-free solders, current commercial isotropic conductive...
