.... e-mail:  debock@ge.com This work is in part a work of the U.S. Government. ASME disclaims all interest in the U.S. Government's contributions. 15 01 2020 01 06 2020 29 06 2020 transient thermal management electronics packaging phase change materials codesign...

.... 31 10 2018 27 02 2019 thermal cycling mechanical cycling electronics packaging reliability accelerated testing fatigue life cycle Flip–chip packaging delivers several advantages over other packaging methods, including more compact packaging and improved thermal management...

... mentioning that, the results presented here are meant only to demonstrate the effect of bond layer with a particular bimaterial electronic package to provide an indication of the nature of stresses. The various combinations of material properties and the thicknesses of individual layers may result...

...Etienne L. Bonnaud Reliable drop test simulations of electronic packages require reliable material characterization of solder joints. Mechanical properties of lead-free solder were here experimentally investigated for both monotonic and cyclic loading at different strain rates. With regards...

... electromagnetics electronics packaging microstrip lines modules optical interconnections optical modulation optoelectronic devices semiconductor lasers As the advanced Fiber to the Subscriber and high-speed optical interconnections requires low cost and compact size transmitters. The semiconductor...

..., but time- and temperature-dependence. For simplification of the stress constitutive models, particularly for applications on electronic packaging can be found in literature, the time-dependent behavior could be neglected. Otherwise, the property only considered as a function of temperature can achieve time...

.... The results indicate that for the potted design, the dynamic response of the processor board is attenuated by the potting material. 14 12 2010 07 07 2011 08 12 2011 08 12 2011 electronics packaging thermal stresses transient analysis weapons Due to the highly dynamic...

...Yongchang Lee; Cemal Basaran Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where...

... and their heat flow rates ( Q ), for an applied power ( P H ) of 1W at 35 °C, then if the applied power increases from 1 W to 2.5 W. Δ T N or Δ Q N definitions are according to Eq. 1 . 22 11 2010 02 08 2011 30 09 2011 30 09 2011 cooling electronics packaging integrated...

... the crack driving force in it and consequently alleviates the risk of the intermetallic compound layer fracturing. 05 02 2011 22 06 2011 14 09 2011 14 09 2011 electronics packaging failure analysis finite element analysis solders solder joint intermetallic compounds...

...M. O. Özdemir; H. Yüncü The objective of this study is to predict numerically the optimal spacing between parallel heat generating boards. The isothermal boards are stacked in a fixed volume of electronic package enclosed by insulated lateral walls, and they are cooled by laminar forced convection...

... current density electromigration electronics packaging failure analysis numerical analysis reliability sensitivity analysis solders electromigration sensitivity analysis time-to-failure It is well known that, as the electronics industry continues to push for high performance...

...Tarek Ragab, Dr.; Cemal Basaran, Dr. 03 04 2011 01 06 2011 01 06 2011 01 07 2011 01 07 2011 carbon nanotubes chirality electron field emission electronics packaging mechanical strength molecular dynamics method nanoelectronics semiconductor nanotubes...

...) are able to correspond to profiles found in XRD database, showing that 304SS has face-centered cubic crystal lattice. The Ni strike technique is used as surface treatment to make 304SS bondable to other metals, such as silver (Ag), copper (Cu), and gold (Au), commonly used in electronic packaging. Cross...

...Drazen Fabris; Michael Rosshirt; Christopher Cardenas; Patrick Wilhite; Toshishige Yamada; Cary Y. Yang Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce high temperatures. TIMs are generally composed of highly conductive particle...

...Marta Rencz 10 03 2011 10 03 2011 cooling electronics packaging heat transfer microchannel flow Microelectronics thermal experts from four continents met in the fall of 2009 at the 15th THERMINIC Workshop in Leuven, Belgium. The event was sponsored by the IEEE Computer...

... compared with the previous two methods while providing much higher efficiency, acceptable CRI, and lifetime ( 5 7 ). light emitting diode correlated color temperature color-rendering index total internal reflection lumens electronics packaging light emitting diodes phosphors silicon...

... properties and develop further simulations of natural convection of nanofluids. However, numerical simulations in such complex problems require much longer computation time and memory allocation. computational fluid dynamics cooling copper electronics packaging laminar flow nanofluidics natural...

... thermal analysis of multilayer assembling structures for power electronic packaging is described in Refs. 1 2 3 . The analytical approach, on which the program is based, was mainly made possible by the simplicity and the high degree of standardization of power assemblies that match for most cases...

...Arun Prakash Raghupathy; John Janssen; Attila Aranyosi; Urmila Ghia; Karman Ghia; William Maltz In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done using...