... assessed as “medium.” Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received July 2003. Associate Editor: G.-Q. Lu. 01 July 2003 08 07 2004 packaging design for environment environmental...

... Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received May 2001; final revision, June 2003. Associate Editor: Y. C. Lee. 01 May 2001 01 June 2003 15 12 2003 microsensors pressure sensors humidity environmental degradation finite element analysis...

...-on-board packaging reflow soldering swelling environmental degradation viscoplasticity life testing finite element analysis ageing thermal stress cracking integrated circuit interconnections The direct attachment of a flip chip die to an organic substrate with eutectic (63Sn/37Pb) solder...

..., 2001. Associate Editor: J. Lau. 12 July 2000 24 April 2001 02 05 2002 integrated circuit packaging moisture environmental degradation adhesion delamination fracture toughness encapsulation soldering masks Of particular interest in reliability studies...

... . Manuscript received by the EEPD January 2000. Associate Editors: B. Courtois and B. Michel. 01 January 2000 integrated circuit packaging plastic packaging moisture environmental degradation moulding encapsulation Plastic encapsulated integrated circuits are gaining interest...