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Keywords: environmental degradation
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Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
Published Online: July 8, 2004
... assessed as “medium.” Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received July 2003. Associate Editor: G.-Q. Lu. 01 July 2003 08 07 2004 packaging design for environment environmental...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 470–474.
Published Online: December 15, 2003
... Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received May 2001; final revision, June 2003. Associate Editor: Y. C. Lee. 01 May 2001 01 June 2003 15 12 2003 microsensors pressure sensors humidity environmental degradation finite element analysis...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 184–187.
Published Online: July 26, 2002
...-on-board packaging reflow soldering swelling environmental degradation viscoplasticity life testing finite element analysis ageing thermal stress cracking integrated circuit interconnections The direct attachment of a flip chip die to an organic substrate with eutectic (63Sn/37Pb) solder...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 106–110.
Published Online: May 2, 2002
..., 2001. Associate Editor: J. Lau. 12 July 2000 24 April 2001 02 05 2002 integrated circuit packaging moisture environmental degradation adhesion delamination fracture toughness encapsulation soldering masks Of particular interest in reliability studies...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 16–18.
Published Online: January 1, 2000
... . Manuscript received by the EEPD January 2000. Associate Editors: B. Courtois and B. Michel. 01 January 2000 integrated circuit packaging plastic packaging moisture environmental degradation moulding encapsulation Plastic encapsulated integrated circuits are gaining interest...