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Keywords: fatigue
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021007.
Paper No: EP-22-1044
Published Online: September 28, 2022
... (LTS) alloys have recently received considerable attention because of their low cost and reduced defects in complex assemblies. The shear and fatigue properties of individual solder joints were tested using an Instron micromechanical testing system in this research. Two novel solder alloys (Sn-58Bi...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
Published Online: April 22, 2022
... a bending radius of 3 mm, due to cracking of the Si die. For the bending fatigue test, the electrical resistance increases after 2000 cycles in 5 mm bending radius, due to fatigue failure of the metal line and bump array. Both the maximum bendability and fatigue lifetime can be significantly improved...
Includes: Supplementary data
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011008.
Paper No: EP-19-1117
Published Online: June 23, 2020
... and fatigue properties of the actual solder joint structure have not been studied for these new alloys. In this paper, a cyclic fatigue test was conducted on individual real solder joints of different alloys, including SnAgCu, SnCu–Bi, SnAgCu–Bi, and SnAgCu–BiSb. The fatigue property of those solder joints...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040802.
Paper No: EP-18-1117
Published Online: May 17, 2019
...Sinan Su; Francy John Akkara; Ravinder Thaper; Atif Alkhazali; Mohammad Hamasha; Sa'd Hamasha Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041003.
Published Online: November 23, 2010
...Ken-ichi Ohguchi; Katsuhiko Sasaki We previously proposed an elastic-plastic-creep model to estimate the fatigue strength of lead-free solder joints subjected to cyclic thermal loading. The proposed model requires detailed experimental data regarding the time-independent plastic strain and the time...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011016.
Published Online: February 25, 2009
...-domain approach, reported by Upadhyayula and Dasgupta (1998, “Guidelines for Physics-of-Failure Based Accelerated Stress Test,” Proceedings, Reliability and Maintainability Symposium, pp. 345–357 ), was adapted in this study for the fatigue analysis. The test board consists of daisy-chained components...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011008.
Published Online: February 4, 2008
..., which focuses on the details of damage initiation and propagation in the individual solder ball. The local model is error seeded with voids based on cases selected in experiment. The damage propagation rate is monitored for all the cases. The technique used to quantify cyclic creep-fatigue damage...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 390–397.
Published Online: October 6, 2004
...Steven Murray; Craig Hillman; Michael Pecht One possible failure mechanism of products containing polyimide dielectric is deadhesion of polyimide from neighboring metallization. Deadhesion usually occurs due to the combined damage mechanisms of environmental aging and fatigue. In this paper...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 135–140.
Published Online: September 28, 2004
... assembly. The procedure is conducive to the numerical assessment of fatigue lives of electronic packages. Hysteresis loops of shear stress versus plastic shear strain Viscoplastic strain energy density versus time In this section the submodeling technique was applied in the thermal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 208–214.
Published Online: July 23, 2004
...C. Basaran; Y. Zhao; H. Tang; J. Gomez Sn-Pb eutectic solder alloy is extensively used in microelectronics packaging interconnects. Due to the high homologous temperature, eutectic Sn-Pb solder exhibits creep-fatigue interaction and significant time-, temperature-, stress-, and rate-dependent...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 148–158.
Published Online: April 30, 2004
...Xianjie Yang; C. L. Chow; K. J. Lau In this paper, a semi-implicit time integration scheme has been developed for a damage-coupled constitutive model to characterize the mechanical behavior of 63Sn-37Pb solder material under thermo-mechanical fatigue (TMF) loading. The scheme is developed...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
Published Online: April 30, 2004
... a constitutive model for solder which couples viscoplasticity with a unified damage theory. The unified damage theory is characterized by a damage surface in strain space which separates fatigue damage from inelastic damage. The damage evolution equations are derived within the framework of irreversible...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 582–588.
Published Online: December 15, 2003
...X. J. Zhao; G. Q. Zhang; J. F. J. M. Caers; L. J. Ernst In this paper, an “interfacial boundary volume” based damage criterion was proposed in combination with the modified Coffin-Manson model to predict solder fatigue. This criterion assumes that mainly, the behavior of the thin solder layer...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 576–581.
Published Online: December 15, 2003
...Chang-An Yuan, Research Assistant; Kou-Ning Chiang, Professor Due to the CPU limitation of the computer hardware currently available, the three-dimensional full-scaled finite element model of wafer level packaging is impractical for the reliability analysis and fatigue life prediction. In order...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 531–538.
Published Online: December 15, 2003
..., and Q = 44.9 kJ / mol for Sn63Pb37. Microstructural analyses indicated that small precipitates of Ag 3 Sn and η - Cu 6 Sn 5 intermetallics are responsible for the high values for n and Q that were found for the Sn96.5Ag3.5 and Sn95.5Ag4Cu0.5. The crack growth rate was determined by isothermal fatigue...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 328–333.
Published Online: December 12, 2002
.... The resistance of these interfaces to crack growth was tested under both static and cyclic loading in high and low humidity test environments. These tests allowed the separation of the effects on crack growth due to stress corrosion and cyclic fatigue . Experimental results showed that the density of primary...