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Keywords: foils
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041007.
Published Online: December 9, 2011
...Chu-Hsuan Sha; Pin J. Wang; Wen P. Lin; Chin C. Lee Silver (Ag) foils are bonded to alumina substrates by a low temperature solid state bonding process. The alumina substrate is premetalized with 40 nm titanium tungsten (TiW) and 2.54 μm gold (Au). The bonding temperature is just 260 °C, compatible...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 132–137.
Published Online: February 18, 2000
... source was used. The simulated chip array consisted of five foil strip (4 mm wide) heaters, positioned with the center strip directly beneath the slot nozzle. The velocity of the coolant was varied from 0.53 to 5 m/s, and the subcooling in the range from 2 to 21 K. The experiments were conducted focusing...
